ATS-07A-15-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.52°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-07A-15-C3-R0 is a thermal-heat-sink system designed for improved thermal management in complex electronic applications. This active cooling system utilizes a combination of forced air and liquid cooling to maximize thermal efficiency while minimizing physical size. This type of active cooling system is most commonly used in power electronics, automotive systems, military applications, and semiconductor materials, among many others.

ATS-07A-15-C3-R0 Application Field

The ATS-07A-15-C3-R0 can be used in a variety of applications due to its small size and lightweight construction. It is designed to effectively dissipate heat from surface mounts, processors, and integrated circuits. The system is capable of dissipating up to 64 Watts due to its powerful fan and heatpipe arrangements.The ATS-07A-15-C3-R0 is ideal for applications requiring high power devices and active cooling systems. It can be used in power electronics serving as the main cooling system for the entire system. It is also used in military and semiconductor applications where it is paramount to maintain optimal thermal performance.

ATS-07A-15-C3-R0 Working Principle

The ATS-07A-15-C3-R0 utilizes a combination of forced-air and liquid cooling to effectively dissipate heat from components. The system features a powerful fan that forces air across the fins of the heat sink. This helps cool the fins and components underneath them. The liquid cooling component of the ATS-07A-15-C3-R0 uses a combination of heat pipes and a liquid coolant to further dissipate heat generated from the components and fins. Heat is transported from the heat source via the heat pipes and dissipated by the liquid coolant. This allows the system to perform effectively with higher power demanding components.Additionally, the ATS-07A-15-C3-R0 utilizes a high-performance thermal interface material (TIM) between the fins and the components. This material increases the system’s overall thermal efficiency, allowing it to operate at cooler temperatures.

Conclusion

The ATS-07A-15-C3-R0 is an effective thermal-heat-sink system designed to improve thermal management in complex electronic applications. It utilizes a powerful fan and liquid cooling combination to maximize thermal efficiency while minimizing physical size. This active cooling system is most commonly used in applications requiring high power devices and active cooling systems, such as in power-electronic, military, and semiconductor material applications.

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