| Allicdata Part #: | ATS12243-ND |
| Manufacturer Part#: |
ATS-07A-180-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-180-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks serve as one of the most important mechanisms for regulating or transferring excessive heat away from heat-critical components. The ATS-07A-180-C2-R0 heat sink is a robust and reliable model designed to provide superior cooling efficiency and heat transfer in a wide range of applications. This article will discuss the application fields and working principles of the ATS-07A-180-C2-R0 heat sink in greater detail.
Application Fields
The ATS-07A-180-C2-R0 is primarily used in applications where adequate air flow is not available. This includes areas where forced air cooling is not feasible or in situations where there is a need for improved cooling performance. It is also ideal for applications where space is restricted, and is suitable for both indoor and outdoor use. The ATS-07A-180-C2-R0 provides an excellent combination of efficient heat transfer and small footprint.
The ATS-07A-180-C2-R0 is primarily designed for use in electronics, specifically in cooling components such as processors, integrated circuits, custom circuit boards, digital signal processors, and motor drivers. The heat sink is also well suited for use in medical and instrumentation applications. It can be used in device such as MRI scanners, ultrasound scanners, centrifuges, and other high-precision and sensitive devices.
In addition, the ATS-07A-180-C2-R0 has also been designed to provide superior thermal performance in high power applications, such as automotive and industrial systems. It can be used in electric vehicles, robotics, industrial process controllers, and in outdoor applications.
Working Principle
The ATS-07A-180-C2-R0 is designed to efficiently dissipate large amounts of heat from components such as processors, ICs, and motor drivers. The heat sink uses a combination of fin geometry, advanced materials, and improved surface area to maximize heat dissipation. The fin geometry of the ATS-07A-180-C2-R0 has been designed to provide maximum surface area for heat dissipation and excellent air circulation.
The design of the ATS-07A-180-C2-R0 also includes a built-in heat spreader that helps evenly distribute the heat generated by the component over the surface area of the heat sink. This ensures that the heat is transferred away from the component quickly and efficiently. The built-in heat spreader also helps reduce the thermal resistance between the component and the heat sink.
The ATS-07A-180-C2-R0 also uses a two-part fin design which helps increase the overall surface area of the heat sink. One part of the fin design is a solid fin which extends along the sides of the heat sink. The other part is composed of spaced fins that create a larger surface area for the heat to be transferred away from the component. The use of these spaced fins also helps to keep dust and debris away from the heat sink, enhancing cooling performance.
In addition, the ATS-07A-180-C2-R0 also comes with an advanced thermal interface material that provides superior heat transfer between the heat sink and the component. The thermal interface material also helps to reduce the thermal resistance between the component and the heat sink, improving heat transfer efficiency and cooling performance.
By combining an efficient fin geometry, superior materials, and an advanced thermal interface material, the ATS-07A-180-C2-R0 provides superior cooling performance and improved heat transfer in a variety of applications. Whether it is used in a processor, IC, robotics, or outdoor application, the ATS-07A-180-C2-R0 is capable of providing excellent cooling performance and improved heat transfer.
The specific data is subject to PDF, and the above content is for reference