
Allicdata Part #: | ATS12303-ND |
Manufacturer Part#: |
ATS-07A-60-C2-R0 |
Price: | $ 4.63 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X35MM L-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.20840 |
10 +: | $ 4.09437 |
25 +: | $ 3.86719 |
50 +: | $ 3.63964 |
100 +: | $ 3.41221 |
250 +: | $ 3.18473 |
500 +: | $ 2.95725 |
1000 +: | $ 2.90037 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.36°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions have become increasingly important in the electronics industry as chips, integrated circuits, and other components have become increasingly powerful and complex, with ever-increasing heat dissipating needs. ATS-07A-60-C2-R0 is an example of such a thermal management system, which is used for various thermal management tasks including heat dissipation.
ATS-07A-60-C2-R0 is a thermal heat sink specifically designed to dissipate heat from a variety of electronic devices such as processors, memory modules, and other high-power solid-state devices. The heat sink is made of high quality aluminum alloy and is designed to fit many devices or be mounted on a chassis.
The ATS-07A-60-C2-R0 utilizes a unique combination of features to deliver superior performance. The heat sink is equipped with a 20mm diameter 80mm long heat pipe with an anodized finish to increase heat dissipation, and cooling fins to allow airflow to flow around the heat sink. It also has a special heat dissipation base to make sure that the heat is evenly transferred from the heat source to the heat sink. Additionally, ATS-07A-60-C2-R0 comes with an included fan, allowing for even further heat dissipation.
In order to supply cooling to components that generate high amounts of heat, additional cooling may be necessary. This is where the ATS-07A-60-C2-R0 can be particularly useful. The heat pipes in the heat sink will draw heat away from the heat source, moving it through the heatpipe and cooling fins. The fan will then blow cold air across the fins, further dissipating the heat. The cooling fins are also designed to maximize air flow, allowing the fan to create a more efficient cooling environment.
Aside from its use in cooling components, the ATS-07A-60-C2-R0 can also be used in other applications, such as the chassis of a computer. The heat sink is designed to fit directly into a slot or frame, providing an additional layer of protection from heat-generating components such as hard drives and processors. Additionally, the heat sink can also be used to mount electronic devices or components, as its aluminum body is designed for maximum thermal conductivity and heat dissipation.
In conclusion, the ATS-07A-60-C2-R0 is ideal for a number of different applications and is an excellent choice for a thermal management system. Its heat pipe and cooling fin design provide superior heat dissipation, while its aluminum body is ideal for mounting electronic devices. Additionally, the included fan allows for even further cooling and airflow. As a result, the ATS-07A-60-C2-R0 is an ideal solution for a variety of thermal management and cooling needs.
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