ATS-07A-64-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.36°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are a type of thermal management solution which is used to efficiently dissipate heat away from computer components. The ATS-07A-64-C1-R0 heat sink is a perfect example of a heat sink which is designed to dissipate heat from an embedded system. The ATS-07A-64-C1-R0 heat sink is made from aluminum material and is manufactured using the extrusion process. It is compact in size and is available in various sizes and shapes. The ATS-07A-64-C1-R0 heat sink is designed for use in embedded systems and it is a low cost solution for thermal management. The ATS-07A-64-C1-R0 heat sink has a unique design that helps dissipate heat quickly and efficiently. The ATS-07A-64-C1-R0 has multiple fins which are designed to increase surface area, allowing for faster heat dissipation. The heat sink also has a unique heat sink clip which holds the components securely in place, and the clip is designed to ensure a tight fit between the components and the heat sink itself.The ATS-07A-64-C1-R0 heat sink is composed of an electronic circuit, a heat sink, and a heat sink clip. The electronic circuit is composed of an aluminum substrate and a circuit board and is designed to provide the necessary connection between the embedded system and the heat sink. The circuit board then connects to the heat sink with a copper or aluminum U-shaped clip. The heat sink is designed to transfer heat away from the electronic components and dissipate into the pattern of fins. The design of the fins helps to increase the surface area of the heat sink which allows for faster heat dissipation. The ATS-07A-64-C1-R0 heat sink is designed to provide an efficient and economical thermal solution for embedded systems. It is designed to dissipate heat quickly and efficiently and is a low cost solution for thermal management. The ATS-07A-64-C1-R0 heat sink has a unique design which helps dissipate heat quickly and efficiently and is available in various sizes and shapes. The ATS-07A-64-C1-R0 heat sink is easy to install and is designed to provide a lasting solution for dissipating heat away from embedded systems. The ATS-07A-64-C1-R0 heat sink is a great example of a heat sink which is designed to provide a reliable and efficient thermal solution for embedded systems. The unique design of the ATS-07A-64-C1-R0 heat sink helps dissipate heat quickly and efficiently and is a low cost solution for thermal management. The heat sink is composed of an electronic circuit, a heat sink, and a heat sink clip which all help to dissipate heat away from the embedded system. The heat sink is designed to be easy to install and is designed to provide a lasting solution for dissipating heat away from embedded systems.

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