| Allicdata Part #: | ATS-07A-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-07A-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07A-70-C1-R0 thermal-heat sink is a highly efficient solution to improving the thermal performance of an electronic system. It is composed of two components, a heat sink assembly and a cooling fan. The heat sink assembly is composed of a variety of heat transfer surfaces and a number of base material fins, all of which are assembled into a sealed chamber. The cooling fan draws air across the fins, where the heat is dissipated. The total area of the heat transfer surfaces can be configured to match the power dissipation requirements of the application to optimize cooling while maintaining low noise levels.
The ATS-07A-70-C1-R0 has many advantages over conventional cooling solutions, such as compact size, low cost, and lighter weight. In addition, it has the ability to support higher power dissipation levels than other cooling solutions due to the larger surface area, effectively allowing for a cooler operating environment.
The working principle behind the ATS-07A-70-C1-R0 is based on the principles of air-cooled heat transfer. As the fan draws air across the heat transfer surfaces, the air absorbs the heat from the surfaces. The heated air then flows away from the heat source and is exchanged with cooler air. The cooler air is drawn back through the system, thus cooling off the heat transfer surfaces in the process.
The ATS-07A-70-C1-R0 is an ideal solution for use in a variety of applications. It is suitable for use in server, processor, and data center cooling, as well as being used in LED lighting, telecommunication equipment, and healthcare systems. It is also applicable to consumer electronics, such as gaming consoles, laptops, and mobile phones. Additionally, it is well-suited for automotive applications, such as engine cooling and lighting systems.
Overall, the ATS-07A-70-C1-R0 thermal-heat sink is an excellent solution for cooling systems. Its low cost, compact size, and light weight make it ideal for a variety of applications. Additionally, its high power dissipation capabilities and excellent thermal performance make it an excellent choice for many electronic systems.
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