| Allicdata Part #: | ATS-07A-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-07A-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07A-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-07A-73-C1-R0 heat sink is a thermal management device used to dissipate heat generated by electronic components. It is made from a combination of heat conductive materials that form a cooling fin structure. The heat sink\'s design effectively dissipates heat from the component, while still remaining small in size and relatively lightweight. This makes it suitable for use in a variety of industrial and consumer applications.
Application Field
The ATS-07A-73-C1-R0 is mainly used as a heat sink in applications such as medical equipment, consumer electronics, telecommunications equipment, automotive electronics, and other commercial equipment. It is often used in applications that require high heat dissipation capabilities in a lightweight and compact package. In addition, the heat sink is ideal for applications that require tight installation spaces and low acoustic noise.
The ATS-07A-73-C1-R0 is also well-suited for use in low-cost, low-performance, low-profile and ultra-small product designs. Its low-profile design and lightweight structure also makes it an attractive heat sink option for wearable device designs.
Working Principle
The ATS-07A-73-C1-R0 heat sink works on the principle of heat dissipation. This is accomplished through the heat conductive properties of the various materials, which create a cooling fin structure. Heat energy is transferred between the component and the thermally conductive material, allowing for the heat to be rapidly and evenly dissipated.
The heat sink also makes use of airflow to increase its effectiveness. Airflow is directed over the cooling fins which helps to carry away heat energy and further reduce the temperature of the system.
Conclusion
The ATS-07A-73-C1-R0 heat sink is an ideal thermal management device for many industrial and consumer applications. Its lightweight and low-profile design, combined with its efficient heat dissipation capabilities, make it an attractive choice for small and low-cost designs. Additionally, its heat conductive materials and airflow-driven design further improve its thermal performance.
The specific data is subject to PDF, and the above content is for reference