ATS-07B-01-C1-R0

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ATS-07B-01-C1-R0 application field and working principle

Power semiconductor modules have increasingly high packaging densities, their power and speed demands have increased, their electrical insulation requirements are very strict, the space of the surrounding heat sink air-cooled cooling is limited, at this time in order to dissipate the thermal energy loss from the power module, there are a variety of alternative cooling methods that are used to cool required increased, an ideal solution for thermal management in many applications.

The ATS-07B-01-C1-R0 heat sink is a thermal management component used in such applications for efficient cooling. It is a high performances, and low cost solutions with different mounting options, excellent heat transfer and uniformity is conducted by this helpful cooling product. ATS-07B-01-C1-R0 utilizes an efficient theory to regulate the amount of heat radiator has been developed to better manage the system\'s temperature in enclosed areas.

The ATS-07B-01-C1-R0 is ideally suited in heat sensitive applications for efficient thermal management; it can dissipate heat generated from high-density modules such as telecom, power rectifiers, bridges, transistors, etc and it also can be applied in high thermal efficiency systems such as server systems, core processor, industrial control systems, embedded system, automotive ECU systems, etc.

The ATS-07B-01-C1-R0 is constructed of a heat sink shape heat exchange thermal plate made of aluminum alloy and is equipped with cross-like connecting fins to allow the cool air to pass through and exchange thermal energy. The cross-like connecting fins create an efficient heat conduction channel between the ATS-07B-01-C1-R0 and the attached heat exchange modules. This ensures efficient thermal management of the heat generated from the modules. The ATS-07B-01-C1-R0 also comes with adjustable screws or clips to allow for easy installation and fast change-out for replacement.

The working principle of ATS-07B-01-C1-R0 can be summarized as follows: the ATS-07B-01-C1-R0 utilizes the natural process of air convection to dissipate heat away from the heat exchange plate. The fins on the heat exchange plate are designed with a cross-like structure. This structure allows for maximum heat conduction and insulation of the attached heat exchange elements while creating a natural air flow. The air passes through the fins of the heat exchange plate, which then absorbs and dissipates the thermal energy created from the attached elements. The fins also act as an anti-static shield to protect against static interference from other components or nearby heat sources. The ATS-07B-01-C1-R0 can handle temperatures up to double the temperature of traditional heat sinks, making it an ideal choice for a variety of applications.

In summary, the ATS-07B-01-C1-R0 provides a compact and efficient solution for thermal management in many applications. It features adjustable screws or clips for fast and easy installation and removal; has an adjustable cross-like connecting fins to allow the airflow to pass through; is constructed of high-quality aluminum alloy for maximum heat transfer efficiency; and can fit in confined space areas. The ATS-07B-01-C1-R0 is ideal for thermal management in high density applications, and provides flexibility to tailor the radiator for each application.

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