| Allicdata Part #: | ATS12390-ND |
| Manufacturer Part#: |
ATS-07B-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices that increase the surface area of a component in order to disperse heat more effectively. The ATS- 07B-134-C2-R0 is an example of such a device, designed to improve the heat dissipation of high power devices such as CPUs, GPU’s, and FPGA’s. This article will cover the fields of application and working principles for the ATS-07B-134-C2-R0.
Application Field
The primary application fields for the ATS-07B-134- C2-R0 are for CPU and GPU cooling solutions. It has been designed to be compatible with a wide range of CPU and GPU models, including Intel, AMD and NVIDIA graphics chips. The device has also been designed to fit in a standard case, making installation relatively straightforward. The device is also suitable for cooling FPGA’s, as it offers a higher thermal conductivity than traditional air-cooled solutions. This makes it an ideal choice for FPGA-based applications that require stable performance under high thermal loads.
Working Principle
The working principle of ATS-07B-134-C2-R0 is quite simple. It is designed to dissipate the heat generated by high power devices such as CPUs and GPUs. The device consists of a base plate, heat sink fins, and a fan. The base plate is made from an aluminium alloy which has a high thermal conductivity, allowing it to effectively transfer heat away from the device. The heat sink fins are designed to provide a larger surface area, allowing the heat to be dissipated more effectively. The fan is then used to draw the hot air away from the fins, ensuring the device remains cool.
The ATS-07B-134-C2-R0 also features an optimized design for better heat dissipation. The fins are calibrated using a precise process to ensure that each fin has a uniform length, maximising their surface area for better thermal transference. The device also includes a 4-pin PWM fan connector, allowing you to change the speed of the fan depending on the cooling requirements of the device.
Conclusion
The ATS-07B-134-C2-R0 is a Thermal - Heat Sink that has been designed to improve the cooling performance of high power devices such as CPUs, GPU’s and FPGA’s. It features an optimised design for better heat dissipation, and is compatible with a wide range of CPU and GPU models. The device is relatively easy to install and includes a 4-pin PWM fan connector, allowing the user to change the fan speed depending on the cooling requirements of the device.
The specific data is subject to PDF, and the above content is for reference