| Allicdata Part #: | ATS12435-ND |
| Manufacturer Part#: |
ATS-07B-175-C2-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-175-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.57840 |
| 10 +: | $ 3.48138 |
| 25 +: | $ 3.28810 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key issue in the design of electronic systems. As the systems generate heat, ambient temperatures can be elevated, resulting in system malfunctions and even burnouts. Various thermal components, such as fans, heat sinks, heat pipes, and thermal interface materials are used to remove the heat generated by the electronic components and dissipate it into the environment, thus providing ambient temperatures suitable for systems operation.
The ATS-07B-175-C2-R0 is a high performance aluminum heat sink designed for application in electronic systems. This is a complex heat dissipating unit, having 0.4mm wide fins with 2.2mm spaces between each fin, providing 60% more thermal conductivity in comparison to standard aluminum heat sinks. This is beneficial for mounted components that generate more heat and require faster thermal dissipation.
The working principle of the ATS-07B-175-C2-R0 is that it is designed for optimal thermal transfer from a mounted component to the environment by utilizing convection. This is accomplished through the use of its extended fin and the natural phenomenon of air convection. Heat is first transferred through its mounted component to the heat sink, then through the heat sink fin via thermal conductivity, and finally out of the system by natural air convection.
Because of its features and structure, the ATS-07B-175-C2-R0 is ideal for use in applications such as communication systems, medical equipment, industrial equipment, server systems, PCs, lap-top computers, and consumer electronics. Additionally, its modular design makes it ideal for use where thermal cooling requirements are significant. Its design also makes it highly resistant to oxidization.
The ATS-07B-175-C2-R0 is a critical thermal component due to its effective thermal dissipation and efficient air convection. Its design makes it suitable for environments with variable temperatures, and its increased thermal conductivity allows it to handle components that generate more heat. For these reasons, it is a valuable addition to any application where thermal management is a primary concern.
The specific data is subject to PDF, and the above content is for reference