| Allicdata Part #: | ATS-07B-179-C3-R0-ND |
| Manufacturer Part#: |
ATS-07B-179-C3-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-179-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-07B-179-C3-R0 is a type of thermal-heat sink designed to dissipate heat away from sensitive or vulnerable electronic components, hence protecting them from overheating. It is especially effective and widely used in high-powered, high-locality, and highly sensitive electronic systems, due to its unique features and capabilities.
The thermal-heat sinks utilize a highly conductive aluminum or a combination of aluminum and copper to spread and dissipate heat more effectively. The heat transfer within such devices is enhanced by a combination of mechanical and thermal processes, allowing for the most efficient transfer and dissipation of the heat.
The core of this thermal-heat sink is the heat sink’s base, which is typically made up of either aluminum or copper. This material allows for the most efficient conduction of heat, and its high heat capacity further enhances its performance. The base also features fins, which are designed to increase the surface-to-surface area ratio and further increase thermal performance. These heat sinks can also feature various levels of insulation to prevent overheating of sensitive electronic components.
The design of this thermal-heat sink ensures effective and efficient transfer and dissipation of heat. The heat is transferred through the base of the heat sink, which is usually made from either aluminum or copper. The heat is then spread through the fins of the heat sink, which help to increase the surface area in contact with the atmosphere. As the air passes through the fins of the heat sink, it helps to facilitate the transport of heat away from sensitive areas and components, thus protecting them from the risk of overheating.
The thermal-heat sink technology is highly reliable and consistent, offering excellent protection from heat in high-powered electronics systems and other sensitive areas. The safety and longevity of such electronic components can be greatly enhanced by the installation of a thermal-heat sink, as it helps to prevent the overheating of vulnerable components and reduce the risk of damage.
In short, the ATS-07B-179-C3-R0 thermal-heat sink is a superior thermal-heat management solution. It excels in its design, featuring an efficient material structure and optimal design configurations for effective and reliable heat transfer. With its features and capabilities, this heat sink provides increased stability for sensitive electronic components, enhancing the safety and longevity of the system.
The specific data is subject to PDF, and the above content is for reference