ATS-07B-20-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-07B-20-C1-R0: thermal - heat Sinks- application field and working principle

Thermal - Heat Sinks are a type of cooling component used to dissipate heat from devices such as processors and transistors. They are generally constructed of metal - usually aluminum or copper - and typically consist of a base, a series of fins, and fans or other air-moving components. Thermal - Heat Sinks are designed to transfer heat from the source (e.g., the processor) to the surrounding air. As heat is transferred away from the source, it is dissipated into the air, thus keeping the source cool.ATS-07B-20-C1-R0 is a type of thermal - heat sink. It is a relatively compact heat sink focused on processor and transistor cooling, that is designed to be used in systems constrained by limited form factors or demanding high performance cooling solutions. It is made from aluminum and its design consists of a Heat Sink Base, a fin structure, and a fan.The Heat Sink Base is made from aluminum and is designed to provide a low thermal resistance path from the processor or transistor to the fins. The fins are generally constructed of aluminum and extend above the heat sink base. They help to increase the surface area of the heat sink, thus increasing the rate of heat transfer and helping to dissipate the heat more effectively. The fan is an air-moving component that pushes air through the heat sink fins, helping to increase the rate of heat transfer and dissipate heat more quickly.ATS-07B-20-C1-R0 is suitable for a wide range of CPU and transistor cooling applications. It is a highly efficient thermal - heat sink that can dissipate up to 40W of heat. It is also suitable for use in space constrained systems, as it is just 20mm high and its fin array is 35.5mm² in size.The working principle of the ATS-07B-20-C1-R0 Thermal - Heat Sink is based on the law of thermal dynamics. Heat from the processor or transistor is transferred by conduction (a type of heat transfer) through the heat sink base to the fins. Heat is then transferred away from the fins by convection (a type of air-based heat transfer) as air is circulated through the fins. This air movement is created by the fan installed on top of the heat sink, and helps to dissipate the heat more quickly.By using a combination of conduction and convection, the ATS-07B-20-C1-R0 Thermal - Heat Sink is able to achieve highly efficient heat transfer, allowing it to dissipate high levels of heat quickly and effectively. This makes ATS-07B-20-C1-R0 an ideal solution for thermal management in systems limited by size or performance requirements.

The specific data is subject to PDF, and the above content is for reference