| Allicdata Part #: | ATS-07B-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-07B-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important engineering discipline that is integral to the operation of electronic systems. Heat dissipation is a major challenge that must be addressed in order to keep delicate electrical components within their recommended operating temperature range. Heat sinks are one type of cooling component that help to keep electronics within their recommended temperature ranges during operation. The ATS-07B-20-C3-R0 heat sink is a reliable and effective solution for thermal management.
ATS-07B-20-C3-R0 Application Field
The ATS-07B-20-C3-R0 is a cost-effective heat sink designed for a variety of applications. It is well-suited for use in indoor applications, particularly in high ambient temperature areas, including in engine compartments and electronics control rooms. This versatile and lightweight heat sink allows a large degree of flexibility of deployment in many different applications. The ATS-07B-20-C3-R0 is also certified to MIL-STD-461G, making it suitable for use in harsh environments. This heat sink has its primary application in cooling high-powered electronics. It is widely used in the telecommunications and defense industries, as well as in commercial and industrial applications, such as telemetry, vehicle and rail traffic control systems, and medical treatments using radiation.
Features
The ATS-07B-20-C3-R0 heat sink design is based on a powerful 40-watt inline fan with a 7.87-in. air cooled aluminum fin, and a low profile chassis. The fan delivers a powerful airflow of up to 35 CFM (6.43 m3/min), and is capable of providing laminar cooling through its virtually silent operation. The non-rusting aluminum fin also helps to dissipate heat quickly and efficiently. The ATS-07B-20-C3-R0 heat sink includes mounting holes for easy installation and features optional forward and reverse rotation for greater adaptability. The heat sink also comes with a 12-bladed impeller guard for additional protection.
Working Principle
The working principle of the ATS-07B-20-C3-R0 is simple yet effective. The design of the fan and the air cooled aluminum fin provide multiple paths for heat to escape from the electronics. First, the fan draws in air from the surrounding environment and passes it through the fins. The air then picks up the heat from the electronics and carries it away. The fins act as a radiator, allowing the heated air to dissipate and spread out. This reduces the surface temperature of the electronics and keeps them within their prescribed operating range. The ATS-07B-20-C3-R0 also features reverse rotation, allowing the fan to be operated in opposite directions to maximize cooling and heating uniformity.
Conclusion
The ATS-07B-20-C3-R0 is a high quality thermal management solution suitable for all indoor applications. Its efficient working principle, versatile design, and certified to MIL-STD-461G make the ATS-07B-20-C3-R0 a reliable and cost-effective heat sink solution. The ATS-07B-20-C3-R0 can deliver powerful air flows to efficiently cool high-powered electronics and thus increase their lifetime and performance.
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