![ATS-07B-200-C1-R0 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | ATS-07B-200-C1-R0-ND |
Manufacturer Part#: |
ATS-07B-200-C1-R0 |
Price: | $ 3.21 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X10MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.91942 |
30 +: | $ 2.84046 |
50 +: | $ 2.68267 |
100 +: | $ 2.52485 |
250 +: | $ 2.36704 |
500 +: | $ 2.28813 |
1000 +: | $ 2.05143 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.76°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are thermal devices applied to components to absorb and remove heat. They often serve dual functions; to cool the component and to protect it from damage which may result from its overheating. Heat sinks usually consist of multiple metal fins, although many other shapes and designs are possible.
One of the most common types of heat sinks is the ATS-07B-200-C1-R0. This type of heat sink is made up of a solid aluminum heat sink base and multiple, thin, straight aluminum fins which extend outwards. The design of the fins helps to dissipate heat quickly by increasing the surface area of the fins.
The primary function of the ATS-07B-200-C1-R0 is to absorb and disperse the heat generated by components. This is done by transferring the heat from the component to the surface of the heat sink. Once the heat is on the surface, it is dissipated into the air by convection. The heat is transferred away from the component by conduction.
In order to be effective, the ATS-07B-200-C1-R0 must be attached to the component in some way. Often this is done using screws and bolts. It is important to ensure that the screws and bolts are properly tightened and that the thermal grease is evenly applied to the heat sink and component surface. This will ensure optimal conduction and help to ensure that the component does not overheat.
The ATS-07B-200-C1-R0 heat sink is primarily used in applications which require high levels of thermal performance. They are often used in CPUs, GPUs, power regulators, and other high-performance components. The size of the heat sink should be chosen based on the heat production of the component. If the heat sink is not large enough, then it will not be able to effectively dissipate heat away from the component and therefore will not be able to protect it from overheating.
In conclusion, the ATS-07B-200-C1-R0 heat sink is a thermal device which is used to absorb and disperse the heat generated by components. Its primary function is to protect components from overheating and damage which may result from its overheating. It is important to ensure that the heat sink is of the correct size and that it is properly attached to the component in order to ensure its effectiveness.
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