ATS-07B-28-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.57°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThermal energy from electrical components must be dissipated from a variety of electronic devices. Heat sinks are a key component of the thermal control system for almost any electronic device. Heat sinks in particular are often used to dissipate heat from individual parts and components within a larger electronic device. The ATS-07B-28-C1-R0 series is a thermal-heat sink meant for cooling off internal components of electronic devices.Design of the ATS-07B-28-C1-R0The ATS-07B-28-C1-R0 thermal-heat sink is composed of two separate parts – a base and a cover. The base is a high pressure die cast aluminum base, which is fitted with a large number of thin fins that are designed to maximize the surface area of the heat exchange surface. The cover is constructed from an aluminum alloy that has been reinforced by zinc or copper diffusion. This combination of materials allows for maximum thermal dissipation, while still providing sufficient structural strength to support the components that are placed on the heat sink.Application Field & Working PrincipleThe ATS-07B-28-C1-R0 thermal-heat sink is suitable for a wide variety of applications, including cooling electrical components such as processors, graphics cards, memory modules, power transistors, and other complex components. It is most frequently used in the fields of industrial automation, computers, telecommunications, robotics, and other high-tech equipment.The primary principle behind the ATS-07B-28-C1-R0 thermal-heat sink is to conduct the thermal energy away from the components that it is placed over. This is accomplished through thermal conduction. The heat is conducted away from the components by transferring it from the higher-temperature components to the lower-temperature fins on the heat sink. The fins are made from an aluminum alloy and have a very large surface area, allowing for maximum heat dissipation. Additionally, the fins are designed in a way that maximizes the airflow over the surface of the heat sink, which further aids in thermal dissipation.ConclusionThe ATS-07B-28-C1-R0 thermal-heat sink is an efficient and reliable solution for cooling off electrical components in electronic devices. Its sturdy design and use of aluminum alloys make for maximum thermal dissipation while ensuring the structural integrity of the heat sink. The design also maximizes the airflow over the fins, which further aids in effective heat dissipation. All in all, the ATS-07B-28-C1-R0 is a reliable and cost-effective solution to cooling off electrical components in a variety of electronic devices.

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