ATS-07B-28-C3-R0

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Thermal heat sinks are used in a variety of applications to dissipate heat generated by electronic components. They’re usually attached to the surface of a component to maximize heat transfer away from the device. ATS-07B-28-C3-R0, is a type of thermal heat sink, that serve this purpose.

Construction: ATS-07B-28-C3-R0 is a uniquely designed, based on a construction concept which incorporates a designed skeleton and profiled fins. The skeleton is made of aluminium or magnesium and the fins are cast aluminium. The electric component is mounted on the aluminum base side of the matrix, and the heat dissipating fins are situated on the opposite side, allowing the heat to be dissipated more efficiently.

Performance: The ATS-07B-28-C3-R0 design includes multiple fins to increase the surface area which in turn helps in thermal efficiency. The greater the surface area, the better the heat transfer. The larger surface area in a relatively small footprint means that the heat sink produces more thermal performance. This will ensure that the device that is being cooled, runs at optimal temperatures.

Mounting: Instead of the traditional flat surfaces where thermal paste that can reduce thermal performance, the ATS-07B-28-C3-R0 design comes with an extended \'hook\' structure. This \'hook\' design provides a secure connection between the heat sink and the component it is connected to, so the performance of the heat sink is maximized. The design also ensures the maximum amount of contact between the heat sink and the component, reducing the refutation rate of the heat sink.

Characteristics: The ATS-07B-28-C3-R0 thermal heat sink is designed to have a low thermal resistance value, meaning that it can dissipate large amounts of heat from a component. It also has the ability to operate in temperature ranges from -20°C to 80°C. This makes it an ideal choice for cooling electronics devices in harsh environment conditions.

Application: The ATS-07B-28-C3-R0 is a versatile thermal heat sink that is applicable for a wide range of applications. It is usually used in applications where efficient heat transfer is required. For example, it can be used in servers, telecommunication systems, computer peripherals, automotive electronic systems, power supplies, storage systems, medical devices, data centers, home entertainment systems, etc.

Working principle: The functioning of ATS-07B-28-C3-R0 mainly depends on natural convection or thermal radiation for heat transfer. Natural convection is the flow of heat between two points due to a difference in their temperatures. When a hot surface is exposed to air, the air surrounding it gets heated and rises. This motion of air transfers the heat away from the device. Thermal radiation is a process wherein heat is transferred from one end to the other by means of infrared radiation. This infrared radiation helps to dissipate heat from the device into the surrounding atmosphere.

The ATS-07B-28-C3-R0 is highly efficient in the transfer of large amounts of heat, making it suitable for various applications for maximum performance. The unique design and construction contributes to the capability of this thermal heat sink to deliver exceptional performance.

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