| Allicdata Part #: | ATS12482-ND |
| Manufacturer Part#: |
ATS-07B-29-C2-R0 |
| Price: | $ 8.34 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-29-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 7.50960 |
| 10 +: | $ 7.09002 |
| 25 +: | $ 6.67271 |
| 50 +: | $ 6.25577 |
| 100 +: | $ 5.83865 |
| 250 +: | $ 5.42163 |
| 500 +: | $ 5.31735 |
| 1000 +: | $ 5.21309 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.The ATS-07B-29-C2-R0 model is a thermal heat sink designed for use in electronic cooling applications. As heat builds up in electronic equipment, the heat sink helps to dissipate it by transferring the heat away from the device and into the ambient atmosphere. The heat sink is designed with an external metallic surface and fins that help to increase the area available for heat transfer. This allows for greater levels of cooling as more heat can be dissipated.
At its core, the ATS-07B-29-C2-R0 consists of a number of components. The main component is a copper base plate with a layer of insulation on top. This plate helps to conduct and dissipate heat away from the device. On top of the plate there are a number of aluminum fins arranged in a specific pattern. These fins help to increase the surface area of the heat sink for greater levels of cooling. The fins are also designed to be highly efficient, promoting maximum heat dissipation.
The ATS-07B-29-C2-R0 also features a two-stage cooling process. In the first stage, the heat is transferred from the device to the copper base plate. This plate is designed to quickly draw the heat away, providing a fast cooling rate. In the second stage, the heat is transferred from the copper base plate to the aluminum fins. The fins are designed to provide a much larger surface area, allowing for greater levels of cooling. The air flow around the fins helps to dissipate the heat into the atmosphere.
The ATS-07B-29-C2-R0 is designed to be an efficient and effective cooling solution for a variety of electronic equipment. The two-stage cooling process provides a quick rate of heat dissipation while the aluminum fins provide a large surface area for greater levels of cooling. The size of the ATS-07B-29-C2-R0 makes it an ideal solution for those looking for a compact and efficient heat sink. The device is highly reliable and easy to install, making it the perfect choice for those looking for optimal cooling capabilities.
The specific data is subject to PDF, and the above content is for reference