| Allicdata Part #: | ATS-07B-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-07B-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-07B-30-C1-R0: Thermal-Heat Sinks Application Field and Working Principle
A thermal-heat sink is a device that increases the efficiency of heat transfer by increasing the surface area for heat dissipation, thus eliminating heat pockets and hotspots. In the electronics industry, the ATS-07B-30-C1-R0 is one of the most commonly used thermal-heat sink for any application requiring advanced thermal management. This high-performance cooling solution is suitable for both industrial and consumer applications.
ATS-07B-30-C1-R0 Application Field
The ATS-07B-30-C1-R0 is primarily used in applications that require good heat dissipation rate. Such applications include power side cooling, ASIC/FPGA, server/storage, automotive thermal management, communications, computing, and LED. It can also be used for medical, industrial, and automotive applications. With its wide range of applications, the ATS-07B-30-C1-R0 is able to optimize thermal management for any situation.
ATS-07B-30-C1-R0 Working Principle
The ATS-07B-30-C1-R0 has a built-in heat sink designed to work in a process called heat transference. Through heat transfer, unwanted heat is removed from the primary device to the environment through a thermal barrier. The heat sink then dissipates the heat through conduction, convection, and radiation.
At the core of the ATS-07B-30-C1-R0 is an extruded aluminum profile body. This body houses a series of heat pipes connected to a high-density board and heat sink fins. These heat pipes allow the heat to be transferred from the primary device to the outer surface of the heat sink. The heat sink fins then dissipate the heat away thanks to their large surface area. Finally, a large cooling fan located at the base of the heat sink expels the heated air away from the system.
The ATS-07B-30-C1-R0 also features a patented clip design for easy assembly and installation. Thanks to this design, the heat sink can be quickly and securely attached to the main device, providing a tight and compact seal.
Overall, the ATS-07B-30-C1-R0 is an efficient thermal-heat sink that can efficiently dissipate heat from any electronic device. Its high-performance cooling solution is suitable for high-power applications such as power side cooling, ASIC/FPGA, server/storage, automotive thermal management, and LED. It features a patented clip design for easy assembly and installation, making it an ideal choice for any electronics application requiring advanced thermal management.
The specific data is subject to PDF, and the above content is for reference