| Allicdata Part #: | ATS-07B-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-07B-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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：Thermal - Heat Sinks: ATS-07B-30-C3-R0 Application Field and Working Principle
Heat sinks are becoming increasingly popular in the electronics industry, particularly due to their ability to dissipate heat created by electronic components. The ATS-07B-30-C3-R0 is an example of one such device, widely used in a variety of different applications. In this article, we will discuss the application fields and working principle of the ATS-07B-30-C3-R0.
Application Fields
The ATS-07B-30-C3-R0 is a low-profile heat sink constructed from excellent thermal materials. The device features high heat transfer efficiency with low-profile design alloy copper brackets, and is designed with four mounting sides to allow superior conversions for complex installation. The device is extremely lightweight, has excellent air flow and provides superior heat dissipation performance. The ATS-07B-30-C3-R0 is ideal for controlling the flow of heat in highly sensitive products such as power supplies, LED drivers, and computers. The wide range of applications for the ATS-07B-30-C3-R0 make it an excellent choice for the electronics industry.
Working Principle
The ATS-07B-30-C3-R0 works by utilizing a unique shape that provides excellent heat transfer from the electronics components, to the heat sink where it is dissipated. The unique shape of the device allows for more efficient air flow, which quickly carries heat away from the components. This efficient air flow is made possible by the specific design and high quality materials utilized for the construction of the device. The combination of materials and design features allows the ATS-07B-30-C3-R0 to effectively dissipate excess heat without dissipating noise or vibration.
In addition to the efficient design, the ATS-07B-30-C3-R0 also makes use of advanced thermal materials that are tailored to suit the needs of specific applications. These materials are designed to ensure maximum heat transfer and minimal noise, and are highly effective at dissipating heat without negatively impacting the surrounding environment. The ATS-07B-30-C3-R0 is a reliable solution for controlled airflow and heat dissipation.
Conclusion
In conclusion, the ATS-07B-30-C3-R0 is an ideal solution for dissipating heat in a range of different electronic components. The device is designed to provide excellent heat transfer, quickly dissipating heat while remaining quiet and efficient. The high quality materials used for the device’s construction provide exceptional air flow, and the four mounting sides allow for flexible installation for complex applications. The ATS-07B-30-C3-R0 is a reliable, effective solution for heat dissipating needs.
The specific data is subject to PDF, and the above content is for reference