| Allicdata Part #: | ATS-07B-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-07B-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat from an electronic component, typically a semiconductor, that produces excess amounts of heat. A heat sink is primarily composed of a metal that conducts heat away from the device and a large surface area that provides the maximum possible amount of contact area with the air. The ATS-07B-46-C3-R0 thermal heat sink is a high-performance heat dissipating device designed to maximize the thermal management of a range of electronic components and systems.
The ATS-07B-46-C3-R0 heat sink is a versatile design that can be used for a variety of applications. It is designed to effectively dissipate significant amounts of heat from high-performance electronic components such as microprocessors, CPUs, and graphics processors. Additionally, it can also be used in a variety of control systems, as well as medical, laser, and imaging equipment. The device can be easily configured for use in most any application, providing a high level of thermal management.
The ATS-07B-46-C3-R0 thermal heat sink utilizes a patented design featuring an efficient fin design that maximizes the amount of heat that can be dissipated from the component. The fin construction maximizes the contact area with the air and is designed for high-performance cooling. The fins are made of high-grade aluminum for increased durability and superior heat conductivity. Additionally, the fins are designed to create an air circulation pattern that cools the component more efficiently.
The ATS-07B-46-C3-R0 thermal heat sink is designed to be easily installed and configured via the use of mounting screws or clips. It also features an innovative mounting system that allows it to be installed without the use of any tools. The device is designed to be compatible with a wide range of standard mounting configurations, allowing it to be used in most any application.
The ATS-07B-46-C3-R0 thermal heat sink is designed to operate at a maximum temperature of 55°C. This ensures that the device will not overheat, protecting the component from being damaged. Additionally, the device is designed to be extremely efficient, only using the necessary amount of energy to dissipate the heat from the component. This ensures that the device operates with maximum efficiency, providing maximum thermal performance for the component.
The ATS-07B-46-C3-R0 thermal heat sink is an effective and powerful solution for effective thermal management of electronic components and systems. The device provides a high level of cooling and is designed to be compatible with a range of mounting configurations. The device is capable of dissipating large amounts of heat from a variety of components and is designed to operate efficiently and effectively. By using the ATS-07B-46-C3-R0 thermal heat sink, users can ensure that their components remain properly cooled and safe from potential damage due to excessive heat.
The specific data is subject to PDF, and the above content is for reference