| Allicdata Part #: | ATS-07B-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-07B-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07B-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are commonly used components in the electronics industry. They are devices that help to dissipate heat from a device, thus allowing the device to operate at a lower temperature. The ATS-07B-60-C3-R0 is a type of heat sink, specifically designed for use in a range of applications. This article will discuss the application field and working principle of this thermal product.
The ATS-07B-60-C3-R0 is a type of cooling component that is designed for applications with a high power density. It is designed to allow for efficient cooling without additional infrastructure, thus making it ideal for use in very limited thermal management spaces. For instance, this product is suitable for use in compact heatsinks, small form factor systems, and power electronics applications. It also has the capability to cool down high power processors, I/O cards, and fanless designs.
This heat sink uses a bridge plate which acts as an interface between an electronic board and the heat sink. This plate increases the thermal conductivity, thereby allowing better heat dispersion. This product is also designed with a fin geometry that is optimized to prevent heat build-up on the PCB. It also helps the heat sink to be efficiently cooled by air movement.
The ATS-07B-60-C3-R0 features an advanced mounting system, which is designed to provide a secure fit that also allows for an efficient air flow. It is also designed with a range of features that help to further increase efficiency. This includes improved thermal performance, high efficient heat spread, and flexibility in use. Additionally, the product is compatible with a range of multiple mounting systems, such as PCIe card systems and heatsinks.
In terms of its working principle, the ATS-07B-60-C3-R0 is essentially a heat transfer device. It works by taking in the heat from the system being cooled and transfers it to the air by conduction, convection, or radiation. The bridge plate helps to ensure the best possible Heat transfer from the board or processor to the heat sink. The fins then function to dissipate the heat away from the heat sink and into the air, significantly increasing the cooling efficiency.
Overall, the ATS-07B-60-C3-R0 is an advanced type of heat sink that offers an efficient solution for thermal management in applications with high power densities. The product offers a range of features, including improved thermal performance and a mounting system that allows for efficient cooling. This product also functions on a basic principle of heat transfer, transferring the heat from the system to the heat sink and then dissipating it away from the heat sink as efficiently as possible.
The specific data is subject to PDF, and the above content is for reference