ATS-07B-87-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin

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Thermal - Heat Sinks

With advances in technology, more and more people are discovering the benefits of utilizing thermal-related products to improve efficiency in their processes. Thermal-related products that are particularly popular include heat sinks, which are designed to absorb, transfer, and dissipate heat away from sensitive components, such as chips, transistors, and other circuit board components. One such thermal-related product is the ATS-07B-87-C2-R0 heat sink, which is widely used in many applications.The ATS-07B-87-C2-R0 is a type of heat sink designed to dissipate heat away from the surface of a component. It features a rectangular shape with a single, rectangular fin that extends from the surface of the heat sink. The fin is designed to have a high surface area to allow it to dissipate heat quickly and efficiently. The heat sink also features an adhesive backing, which allows it to be easily secured in place without needing additional components. The adhesive backing ensures that the heat sink will remain firmly in place and will not move, even when exposed to vibration or shock.In terms of application, the ATS-07B-87-C2-R0 heat sink is primarily used in applications where heat dissipation is required. It is commonly used in circuit boards, as it is able to quickly and efficiently remove heat from the device, preventing damage or malfunction due to excessive temperature. It is also commonly used with memory chips, as it is able to dissipate heat away from the memory chips, preventing the chips from overheating and becoming damaged. In addition, it is often used in other computer components, such as processors, as it is able to keep them from becoming too hot and malfunctioning.In terms of working principle, the ATS-07B-87-C2-R0 heat sink relies on a simple concept: when something is heated, it expands; when something is cooled, it contracts. Heat is transferred away from the surface of a component via the fin of the heat sink, as the heat causes the fin to expand and the surrounding air to become more gaseous. As the air moves away from the fin, it carries heat away from the component, thus cooling the component and preventing it from overheating. The ATS-07B-87-C2-R0 heat sink is a reliable and efficient solution for heat dissipation. It is easy to install, as its adhesive backing eliminates the need for additional components, and its high surface area allows it to quickly dissipate heat from components, preventing them from overheating and becoming damaged. Its rectangular shape also allows it to be easily mounted onto various components, while its simple working principle ensures that it is effective at removing heat from components. In short, the ATS-07B-87-C2-R0 heat sink is an ideal solution for many thermal-related applications, as it is able to quickly and efficiently dissipate heat away from components and prevent them from becoming damaged due to high temperatures.

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