ATS-07C-01-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical component for any electronic system. Heat sinks are just one of the many components used to provide cooling. ATS-07C-01-C3-R0 is a type of heat sink that is designed to draw heat away from sensitive electronics and components, helping to improve system performance and reliability. This article will discuss the application field and working principle of the ATS-07C-01-C3-R0 heat sink.

The ATS-07C-01-C3-R0 is most commonly used in applications such as industrial, medical, power and aerospace as well as consumer electronics; however, it can also be used in other mission-critical applications. The ATS-07C-01-C3-R0 features a range of sizes, from 25 x 25 mm to 100 x 100mm, and can accommodate thermal loads between 0.45C/W and 0.18C/W, making it suitable for a range of applications. The ATS-07C-01-C3-R0 is also designed with a short thermal path, allowing it to transfer more heat to the heat sink’s fins to be drawn away from sensitive components faster.

The ATS-07C-01-C3-R0 can be installed on any printed circuit board (PCB) using standard mounting kits. The design also includes recessed pins, which provide a secure mechanical connection between the heat sink and the PCB, helping to protect components from electrical damage. In addition, the ATS-07C-01-C3-R0 can be easily mounted using standard hardware and does not require any additional tools or additional components for assembly.

The ATS-07C-01-C3-R0 utilizes natural convection to draw heat away from the components, transferring it to the heat sink\'s fins. As warm air is drawn away, cooler air replaces it, lowering the temperature of the components and allowing the system to operate more efficiently. This natural convection process is aided by the fins of the heat sink, which dissipate heat away from the components more efficiently than a flat surface. The fins of the ATS-07C-01-C3-R0 can also be contoured to maximize airflow and heat dissipation.

The ATS-07C-01-C3-R0 also utilizes the thermal compound between the heat sink and the components to transfer heat more efficiently. Thermal compounds, such as ArctiClean, are special compounds that are designed to transfer thermal energy quickly and effectively from one surface to another. When the thermal compound is applied between the heat sink and the components, it lowers the interface resistance and helps to improve the overall thermal performance of the system.

Finally, the ATS-07C-01-C3-R0 is designed to work in high temperatures, making it an ideal choice for applications in extreme environments. The heat sink is designed to resist corrosion and oxidization, helping to ensure that it continues to work effectively over time. The ATS-07C-01-C3-R0 is also RoHS compliant, helping to ensure that it is safe for use in a wide variety of applications.

In conclusion, the ATS-07C-01-C3-R0 heat sink is a reliable and cost-effective solution for cooling mission-critical electronics. It is designed with a short thermal path, allowing it to transfer heat away from sensitive components quickly and efficiently. The recessed pins provide a secure mechanical connection between the heat sink and the PCB, helping to protect components from electrical damage. The ATS-07C-01-C3-R0 can be easily mounted using standard hardware, and the thermal compound helps to improve thermal performance. Finally, the ATS-07C-01-C3-R0 is resistant to corrosion and oxidization and is RoHS compliant, making it an ideal choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference