| Allicdata Part #: | ATS-07C-123-C3-R0-ND |
| Manufacturer Part#: |
ATS-07C-123-C3-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-123-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used in numerous applications, ranging from consumer electronics to industrial machinery applications. The ATS-07C-123-C3-R0 is a type of heat sink that is designed to dissipate heat away from critical components. This device has proven itself as an effective solution in applications where reliability and performance are paramount.
This type of heat sink consists of an interlocking fin structure which is formed into an open frame. This frame features slots or channels for air to flow through and is composed of conductive material such as aluminum, copper or a mixture of both. This design choice allows the heat sink to absorb and disperse heat over a greater area than other materials alone.
The ATS-07C-123-C3-R0, like most other heat sinks, features a base and a heat spreader plate that are designed to wick heat away from critical components. The base is connected to the heat spreader plate which is held in place with mechanical fasteners. The plate ensures proper heat to air transfer and helps to reduce the temperature of the components located on the board.
The ATS-07C-123-C3-R0 is designed to work in two different modes: active and passive. In the active mode, air is forced over the fins by an external fan. The fan increases the airflow, which helps to dissipate heat more quickly. In the passive mode, the heat sink relies on natural convection to dissipate the heat, thus eliminating the need for a fan and making the device quieter.
The ATS-07C-123-C3-R0\'s active mode and passive mode can be chosen depending on the application requirements. In applications where space is limited, the passive mode is preferable as it eliminates the need for additional fans. In more demanding applications, the device can be operated in active mode to ensure optimal cooling performance.
The ATS-07C-123-C3-R0 is designed to dissipate heat away from electronic or electromechanical components, and can also be used for heatsink applications. It is a robust and reliable device that has been proven time and again to be an effective solution in numerous applications. Its practical design, ability to dissipate heat quickly, and low noise output combine to make this heat sink an excellent choice for applications where cooling performance and reliability are of utmost importance.
The specific data is subject to PDF, and the above content is for reference