| Allicdata Part #: | ATS-07C-132-C3-R0-ND |
| Manufacturer Part#: |
ATS-07C-132-C3-R0 |
| Price: | $ 5.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-132-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.70799 |
| 30 +: | $ 4.44612 |
| 50 +: | $ 4.18459 |
| 100 +: | $ 3.92307 |
| 250 +: | $ 3.66153 |
| 500 +: | $ 3.40000 |
| 1000 +: | $ 3.33462 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-07C-132-C3-R0 is part of the Thermal-Heat Sinks family. It is a thermal management solution designed to move heat away from the device it is attached to and into the ambient environment. This type of thermal management is typically used in the automotive, aerospace, and even industrial sectors, as it allows for robust performance in extreme temperatures.
The device features an aluminum block, typically 0.5” thick. This provides the ideal platform for thermal control, as aluminum is an excellent heat conductor. A fan is then attached to the aluminum block to help increase the cooling rate of the device. The fan is typically a 120mm fan, capable of rotating at speeds up to 2500 RPM in order to maximize heat transfer.
The most important component in the device is the heat sink. The heat sink is what allows for this type of thermal management to be successful, as it is designed to absorb heat from the device and dissipate it into the ambient environment. The heat sink is capable of absorbing up to 100W of power generated from the device, allowing it to remain cool even in the most extreme conditions.
In order to ensure the device maintains its efficiency, a bottom plate is also included in the design. This bottom plate is specifically designed to be lightweight and corrosion-resistant, helping to protect the device from any damage caused by the heat generated by the device. This plate also helps to prevent heat from entering the device, as it acts as a barrier and keeps the heat from entering the device directly.
The ATS-07C-132-C3-R0 is designed to work in a variety of different environments, as it is capable of withstanding temperatures ranging from -50C to +100C. This makes it an ideal choice for applications in extreme conditions, such as those found in aerospace and industrial sectors. It also has an IP67 rating, allowing it to be used outdoors without worry of the device suffering any damage due to exposure to the elements.
This device can be used in a variety of different applications and is capable of providing superior levels of thermal management. In particular, it is perfect for applications where extreme levels of performance are needed, such as those found in aerospace and industrial sectors. It is also perfect for applications requiring a reliable and efficient cooling solution, as it is designed to provide the necessary cooling without impacting the performance of the device it is attached to.
The specific data is subject to PDF, and the above content is for reference