ATS-07C-175-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.52°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are components designed to move heat away from an electronic device. Commonly used in computers and other electronic systems, they are typically metallic blocks of aluminum or copper that have fins on their surfaces. There are many sizes, styles, and configurations available on the market today, including the ATS-07C-175-C2-R0. The ATS-07C-175-C2-R0 is a relatively small heat sink designed to provide adequate cooling for Power MOSFET applications. It features an aluminum construction that is lightweight but durable and features a fin profile that improves heat dissipation. Its compact form factor makes it ideal for use in tight spaces or for applications where a large heat sink is not necessary. The working principle behind the ATS-07C-175-C2-R0 heat sink is based on the concept of heat transfer. Heat from the electronic component is absorbed by the metal block and then moves to the fins. As air flows across the fins, it cools the metal, dissipating the heat into the surrounding environment. This process helps to keep the component from overheating and ensures that the desired performance is achieved.The primary application of the ATS-07C-175-C2-R0 is in Power MOSFETs. MOSFETs are transistors used in computers and other electronic systems that allow certain currents to pass through them while blocking others. As they are highly sensitive to heat, they require adequate cooling to ensure performance. As such, the ATS-07C-175-C2-R0 is designed to be used with Power MOSFETs as it can provide the necessary heat dissipation to eliminate potential performance issues.In addition to Power MOSFETs, the ATS-07C-175-C2-R0 can also be used in other electronic components such as diodes, resistors, and transistors. Its small size and low profile make it well-suited for any tight spaces or applications where large heat sinks cannot be used. With its aluminum construction and fin profile, it can adequately dissipate heat, ensuring the component runs within its acceptable temperature range.Overall, the ATS-07C-175-C2-R0 is a versatile and reliable heat sink suitable for Power MOSFETs and other components. Its small size and low profile make it ideal for applications where larger heat sinks are not feasible, and its aluminum construction and fin profile provide optimal heat dissipation. By using this heat sink, users can ensure that their electronic components perform at the level desired with adequate cooling.

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