| Allicdata Part #: | ATS-07C-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-07C-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks, such as the ATS-07C-178-C3-R0, are essential components of any thermal solution. They are designed to transfer heat generated by a device to other surfaces or dissipate it into the air in order to protect the device from overheating. The ATS-07C-178-C3-R0 is one of the most versatile and widely-used thermal solutions available. Here, we discuss the application field and working principle of the ATS-07C-178-C3-R0 heat sink.
Application Field
Heat sinks like the ATS-07C-178-C3-R0 are often used in consumer electronics such as cellular phones, personal media devices, laptops, and tablets. They are also used in industrial equipment such as 3D printers, laser cutters, and PCB assembly equipment. Furthermore, they may also be found in automotive and aerospace applications. The ATS-07C-178-C3-R0 can also be used in high-performance computing applications such as gaming PCs and cryptocurrency mining rigs. Finally, they are an essential component of any cooling system for overclocking.
Working Principle
The principle with which the ATS-07C-178-C3-R0 works is simple. It dissipates the heat generated by the device to which it is attached via the transfer of thermal energy to a cooler surface. The heat sink is designed with a series of metal fins that increase the surface area exposed to air. This increases the amount of air that can come into contact with the heat sink, resulting in faster and more efficient thermal transfer.The ATS-07C-178-C3-R0 also features a thermally conductive adhesive that spreads the heat evenly across the base of the heatsink. This ensures that heat generated by the device is transferred efficiently to the surface of the sink. Additionally, the adhesive provides increased durability and allows for easy installation and removal of the heat sink.
Conclusion
The ATS-07C-178-C3-R0 heat sink is an essential component of any thermal solution. It features a high degree of thermal interface and a thermally conductive adhesive. To ensure efficient thermal transfer, the heat sink is designed with a series of metal fins that increase the surface area exposed to the air. The ATS-07C-178-C3-R0 can be used in consumer electronics, industrial equipment, automotive applications, and high-performance computing applications. It is an essential component for overclocking.
The specific data is subject to PDF, and the above content is for reference