ATS-07C-18-C3-R0

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Thermal - Heat Sinks are relating to applied science and technology of controlling and managing heat and thermal energy. A wide variety of thermal management solutions, from complex heat sink systems to low-cost passive or hybrid technology, are employed in all types of electronic and technology-related applications. The ATS-07C-18-C3-R0 is a unique thermal and heat sink device combining a three-inch-diameter, cold-rolled copper-alloy Hollow Heat Sink (HHS) with a state-of-the-art twopass, recessed-type aluminum fin heat exchanger.

The use of interior fins to exhaust heat energy is an effective method to cool components in electronic and technology applications. This product combines its HHS and aluminum fin heat exchanger technology together to dissipate large amounts of thermal energy efficiently, while taking up minimal space in the application. This type of heat sink is designed for surface mounting and is especially used in larger electronic power supplies, computer systems, and other precision electronic systems that must maintain reliable, consistent temperatures for optimal performance.

The ATS-07C-18-C3-R0 is constructed with an integrated aluminum frame that is both corrosion-resistant and lightweight. A Honeycomb-design heat exchanger is incorporated into the frame for efficient heat transfer. The bottom surface of the frame captures and stores heat energy and the aluminum fins dissipate it. A 1/4 inch-deep recess molded into the frame allows it to be securely mounted to the surface of the component, without any additional fasteners.

This device is engineered to provide flexible mounting using an industry standard four-hole pattern. The ATS-07C-18-C3-R0 also offers thermal performance improvements with the incorporation of high-efficiency, thermally conductive material between the aluminum fins and the copper-alloy HHS. This provides better thermal conductivity than conventional finned heat sinks, which helps satisfy the requirements of higher-powered, high-duty-cycle applications.

The ATS-07C-18-C3-R0 is designed to offer superior thermal management performance and reliability. The device operates in two stages to ensure efficient dissipating of the thermal energy. In the first stage, the aluminum fins efficiently allow the exterior air to pass through them, which absorbs heat energy and transfers it to the interior of the heat sink. In the second stage, the heat sink’s internal air-movement system disperses the heat energy away from electronic components and dissipates the heat energy into the surrounding air. This device is able to control and manage the thermal energy from the components, allowing them to operate at peak efficiency.

The ATS-07C-18-C3-R0 is a great example of advanced heat sink technology used in thermal managing. It is a versatile solution that can be easily integrated into different types of electronic and technology-based applications. It offers good performance with minimal space requirements, and provides reliable and consistent thermal control. This device can also be used in a variety of high-powered applications and is an excellent choice for maintaining optimal thermal performance.

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