ATS-07C-193-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-07C-193-C1-R0-ND

Manufacturer Part#:

ATS-07C-193-C1-R0

Price: $ 3.02
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X6MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07C-193-C1-R0 datasheetATS-07C-193-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.72223
30 +: $ 2.64873
50 +: $ 2.50160
100 +: $ 2.35450
250 +: $ 2.20735
500 +: $ 2.13376
1000 +: $ 1.91302
Stock 1000Can Ship Immediately
$ 3.02
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are important pieces of equipment in technology applications such as power supplies, servers and workstations that generate a large amount of heat. Heat sinks are designed to absorb and dissipate the heat generated from these components so they can keep running efficiently. The ATS-07C-193-C1-R0 thermal-heat sink is designed to provide efficient thermal dissipation for a variety of applications.

The ATS-07C-193-C1-R0 thermal-heat sink is a type of heat sink that utilizes a combination of air convection and fin design to dissipate heat efficiently. The design of the heat sink has a number of protruding fins that increase the air flow across the heat sink which in turn helps to dissipate the heat more quickly. The fins are strategically positioned to facilitate maximum air flow. Additionally, the heat sink is embedded with a copper heat sink to further absorb and dissipate heat.

The ATS-07C-193-C1-R0 thermal-heat sink is designed for use in a variety of applications. It is suitable for use in power supplies, servers, workstations, and other systems that generate heat. Additionally, the heat sink is designed to be compatible with a variety of motherboards including Supermicro, Asus, and Gigabyte. The heat sink can also be used in a desktop form factor.

The ATS-07C-193-C1-R0 thermal-heat sink is a high quality, reliable heat sink that is designed to meet the needs of a wide range of applications. It features a copper heatsink and an array of fins that increase air flow, helping to dissipate heat quickly and efficiently. The heat sink is designed to be compatible with a variety of motherboards and is suitable for use in both desktop and server systems.

The working principle of the ATS-07C-193-C1-R0 thermal-heat sink is quite simple. The heat generated by the components of the system is absorbed by the copper heat sink and then dissipated by the air flow created by the fins. This creates a cooler environment for the components which helps them to perform more efficiently. As the heat is dissipated, the air around the system will remain cooler, allowing for better and longer-lasting performance.

In summary, the ATS-07C-193-C1-R0 thermal-heat sink is an advanced piece of technology designed for a wide variety of applications, ranging from power supplies and servers to workstations and motherboards. The heat sink features copper heat sinks and fins which increase air flow, allowing more effective heat dissipation. The heat sink is designed to improve the performance of components by keeping them cooler, providing for a longer lifespan and more efficient operation. By utilizing this piece of technology, users can ensure their systems stay running more efficiently and for longer.

The specific data is subject to PDF, and the above content is for reference

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