| Allicdata Part #: | ATS12663-ND |
| Manufacturer Part#: |
ATS-07C-202-C2-R0 |
| Price: | $ 4.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X6MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-202-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.76740 |
| 10 +: | $ 3.66660 |
| 25 +: | $ 3.46298 |
| 50 +: | $ 3.25924 |
| 100 +: | $ 3.05556 |
| 250 +: | $ 2.85186 |
| 500 +: | $ 2.64816 |
| 1000 +: | $ 2.59723 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.83°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are essential components that help to cool down CPU’s, GPUs, and other electronic components. They provide a way for heat to escape from electronic components by transferring the heat from those components to the surrounding air. The ATS-07C-202-C2-R0 is a unique type of thermal heat sink solution that has been developed to meet the needs of many applications.
The ATS-07C-202-C2-R0 thermal heat sink is designed to be an efficient, lightweight option for thermal heat sink solutions. It features a unique modular design that allows the sink to be easily customized for specific application needs. The ATS-07C-202-C2-R0 is fabricated from high-quality materials such as aluminum, copper, and stainless steel. Additionally, it comes with an optional multi-layer insulation material to ensure optimal performance in a wide range of temperatures.
The ATS-07C-202-C2-R0 has been designed with a long lifespan in mind. The thermal heat sink is designed to absorb and dissipate heat effectively, ensuring low thermal resistance and long-term reliability. The ATS-07C-202-C2-R0 thermal sink has a low profile design that allows it to fit into tight spaces when needed. Additionally, the sink’s component-specific mounting holes enable easy installation in many applications.
The ATS-07C-202-C2-R0 thermal heat sink can be used in a range of applications, from consumer electronics and automotive to industrial and commercial applications. In consumer electronics, the thermal sink can be used to cool down CPUs and GPUs, prolonging their lifespan. The heat sink can also be used to dissipate heat in automotive and industrial applications, helping to reduce the overall temperature of components that may suffer from high temperatures. Additionally, the ATS-07C-202-C2-R0 can be used in commercial applications as well, such as cooling down servers and other types of hardware.
The ATS-07C-202-C2-R0 thermal heat sink works by absorbing the heat from components and transferring that heat into the surrounding air. It is designed to maximize performance while keeping the overall size and weight of the sink at a minimum. The design of the sink ensures that it efficiently dissipates heat from components, helping to keep them safe from excessive temperatures. Additionally, the ATS-07C-202-C2-R0 thermal heat sink is designed to be easy to install, as it comes with component-specific mounting holes for easy installation.
Overall, the ATS-07C-202-C2-R0 thermal heat sink is an ideal solution for cooling down processors and other components. It is designed with a long lifespan in mind and can be used in a wide range of applications, from consumer electronics to industrial and commercial use. Additionally, the design of the sink ensures that it efficiently dissipates heat from components, helping to keep them safe from excessive temperatures.
The specific data is subject to PDF, and the above content is for reference