ATS-07C-22-C1-R0

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Thermal management is a crucial element in computing and consumer products in order to keep the temperature within an acceptable range. Heat sinks are physical structures that help dissipate heat from devices and are used in electronic systems to increase and maintain thermal performance. ATS-07C-22-C1-R0 is an example of a heat sink designed for a specific application.

The ATS-07C-22-C1-R0 is a copper heat sink manufactured by Alpha Thermal Solutions and designed for high-current, high-temperature applications. This model features an updated fin pattern to optimize performance and reduce heat buildup, as well as an enhanced mounting system to provide more secure contact with the device. It offers superior temperature performance when compared to conventional heat sinks and is an effective choice for compact circuitry and ambient operating temperatures.

This heat sink is designed for efficient heat transfer from a variety of electronic components or subsystems. By using a combination of fins and extruded aluminum bases, this model effectively dissipates heat away from sensitive components. The fin pattern ensures maximum surface area and air contact for maximum cooling and the extrusion air comes out the sides for increased efficiency. It is also designed with adjustable mounting clips to accommodate a variety of circuit boards or components.

In terms of applications, the ATS-07C-22-C1-R0 is ideal for integrated circuits, power supplies, and high power devices. It also works well in environments where space is a factor, such as medical and military applications. It is designed for use with semiconductor junction temperatures up to 150°C and can efficiently handle higher temperatures if installed in a properly ventilated environment. Additionally, this model is RoHS compliant and is suitable for a variety of industrial and consumer applications.

From a working principle standpoint, the ATS-07C-22-C1-R0 relies on thermal conduction to transfer the heat away from the device and into the surrounding air. This model is specifically designed to optimize the transfer of thermal energy from the device to the air, which helps to keep the device running at an optimal temperature. The copper base and fins provide an excellent thermal interface and the adjustable mounting clips ensure the device is secured and provides an airtight seal for maximum effect.

Overall, the ATS-07C-22-C1-R0 is a versatile and efficient heat sink designed for a variety of applications. From semiconductor junction temperatures up to 150°C to components requiring a high level of airtightness, this model is an ideal choice for anyone looking to enhance their thermal performance. Additionally, the design features an adjustable mounting system and a unique fin pattern to provide maximum surface area and air contact for maximum cooling.

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