| Allicdata Part #: | ATS12676-ND |
| Manufacturer Part#: |
ATS-07C-25-C2-R0 |
| Price: | $ 6.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07C-25-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.62590 |
| 10 +: | $ 5.47092 |
| 25 +: | $ 5.16726 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important devices designed to dissipate heat from electronic components. Without adequate power dissipation, electronic devices risk failure or destruction due to overheating. The Power Dissipation Efficiency (PDE) of thermal components is the absolute measure of their efficiency. ATS-07C-25-C2-R0 is one of the most efficient thermal solutions available. It is a high-density aluminum heat sink that offers superior thermal performance for a wide array of applications.
The ATS-07C-25-C2-R0 heat sink is a finned aluminum heat sink that consists of multiple extruded fins that are interconnected in a faceted array. This type of heat sink offers more surface area than a traditional aluminum heat sink alone, increasing its ability to dissipate heat more efficiently. The fins are interspersed by air gaps that further enhance its ability to dissipate heat.
The ATS-07C-25-C2-R0 heat sink allows for maximum heat removal, while still achieving the highest degree of thermal transfer efficiency. This type of heat sink is able to effectively transfer heat from any operating environment. The efficiency of this heat sink results from its fin-to-air gap ratio and its rectangular fin-sensitive design. This design is especially beneficial in applications where space is limited, as it occupies a smaller volume of the already limited space.
The ATS-07C-25-C2-R0’s maximized surface area, coupled with its rectangular fin-sensitive design also ensures a high Power Dissipation Efficiency (PDE) rating. This rating is a measure of the amount of thermal energy the heat sink can effectively transfer to the ambient environment. A higher PDE rating indicates a higher degree of thermal transfer efficiency.
The ATS-07C-25-C2-R0 heat sink can be used in a wide range of applications including power supplies, industrial control systems, medical electronics, compute servers, and consumer electronics. The wide range of heat loads that this heat sink can handle, coupled with its superior thermal performance, make it ideal for applications that require reliable thermal management. In addition, its low profile design allows for easy installation and maintenance.
In conclusion, the ATS-07C-25-C2-R0 heat sink is a high performing, extremely efficient thermal solution. Its superior thermal performance is due to its maximized surface area, rectangular fin-sensitive design, and fin-to-air gap ratio. These design characteristics result in a high Power Dissipation Efficiency rating, making it suitable for a wide range of applications including power supplies, industrial control systems, medical electronics, compute servers, and consumer electronics. Its low profile design allows for easy installation and maintenance.
The specific data is subject to PDF, and the above content is for reference