ATS-07C-34-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.31°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal-Heat Sinks

Thermal-Heat Sinks are an important component in all types of electronic devices, from desktop computers and laptops, to cameras and smartphones. Thermal-Heat Sinks are designed to dissipate the heat generated by the components within the device. This is accomplished by transferring the heat from the components to the Thermal-Heat Sink. In turn, the Thermal-Heat Sink is responsible for dissipating the heat so that the components of the electronic device operate within their desired temperature range.

ATS-07C-34-C1-R0 Application Field and Working Principle

The ATS-07C-34-C1-R0 Thermal-Heat Sink is a low profile, single-side-sink, and is designed to operate in mobile phone, MP3 players, PDAs, and other miniature products. It has excellent heat dissipation characteristics when compared to a traditional aluminum heat sink.The ATS-07C-34-C1-R0 Thermal-Heat Sink is a fanless design, meaning that it is not dependent on mechanical means for its cooling. The interior of the ATS-07C-34-C1-R0 Thermal-Heat Sink is divided into three zones, the evaporator zone, the radiator zone, and the hot chamber.The evaporator zone contains a working gas, which is heated by the components within the electronic device. Once heated, this gas is pushed out of the evaporator by an internal fan. The gas then travels through the cooling section of the Thermal-Heat Sink, which is then cooled by an internal heat exchanger. The cooled gas is then pushed out of the radiator zone, while simultaneously cooling the components within the electronic device.The hot chamber is the third zone of the ATS-07C-34-C1-R0 Thermal-Heat Sink, and it serves to remove the heat produced by the electronics as quickly as possible. The heat is then dissipated into the environment. The heat created in the hot chamber is dissipated in two ways; one, by the external environment absorbing the heat, and two, by active cooling systems such as air-based fans, liquid cooling, or based on phase-change materials. The ATS-07C-34-C1-R0 Thermal-Heat Sink is also highly efficient in its operation. The thermal efficiency of this Thermal-Heat Sink is 95%, meaning that 95% of the heat generated by the components within the electronic device is dissipated. This ensures that the components of the device operate within their desired temperature range.

Conclusion

In conclusion, the ATS-07C-34-C1-R0 Thermal-Heat Sink is a highly efficient, fanless, and low profile product. This Thermal-Heat Sink is suitable for a large range of applications, including mobile phones, MP3 players, PDAs, and miniature products. Its three-zone design ensures that it is highly efficient, and its 95% thermal efficiency ensures that the components within the electronic device operate within their desired temperature range.

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