ATS-07C-57-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-07C-57-C3-R0-ND

Manufacturer Part#:

ATS-07C-57-C3-R0

Price: $ 3.78
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07C-57-C3-R0 datasheetATS-07C-57-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.43539
30 +: $ 3.24450
50 +: $ 3.05361
100 +: $ 2.86278
250 +: $ 2.67193
500 +: $ 2.48108
1000 +: $ 2.43337
Stock 1000Can Ship Immediately
$ 3.78
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions are essential for ensuring safe and reliable operation of electronic components and enable their long-term reliable performance. Heat sinks are one particular type of thermal solution, and the ATS-07C-57-C3-R0 is a heat sink specifically designed for high power applications. This article will discuss the application field and working principle of this heat sink, as well as provide an overview of its features.

The ATS-07C-57-C3-R0 heat sink is primarily used for power amplifiers and similar electronic components with power levels of 0.7W or more. This model is composed of high quality aluminum, making it lightweight and effective at dissipating heat. The heat sink also has an extended surface area, suitable for providing improved cooling capabilities. The advanced design also makes it ideal for use in tight spaces and high-density applications.

The working principle of the ATS-07C-57-C3-R0 is quite straightforward. Heat generated by the power amplifier is dissipated away from the component by the heat sink, either through the sides or through the fins. This allows air to flow around the component, carrying away the heat and providing a cooler environment for the component to operate in. This cooling is very important for ensuring reliable operation of the component and preventing it from reaching damaging temperatures.

The ATS-07C-57-C3-R0 also features a number of other important components. For starters, the heat sink has an integral heat spreader on the underside, which helps disperse heat more evenly across the heat sink and prevents hotspots from forming. There’s also an integrated thermal pad, which helps transfer heat from the component to the heat sink efficiently, as well as an optional wall mount bracket for easy installation and additional stability.

Overall, the ATS-07C-57-C3-R0 is an excellent choice for providing reliable cooling for high-power components. With its advanced design and efficient working principle, this heat sink efficiently transfers heat away from components, ensuring reliable and safe operation. Thanks to its lightweight design, the sink is also suitable for use in tight spaces and high-density applications. If you’re looking for reliable thermal solutions for your power amplifiers and other components, the ATS-07C-57-C3-R0 heat sink should definitely be on your list.

The specific data is subject to PDF, and the above content is for reference

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