ATS-07C-72-C3-R0

Thermal – Heat SinksThe ATS-07C-72-C3-R0 active thermoelectric \'cold plate\' integrated thermal management module is designed to thermally manage and cool a variety of active devices such as Industrial Electronics, Telecom Equipment, Power Supplies, Medical Instrumentation, and Military/Aerospace Electronics. The ATS-07C-72-C3-R0 is ideal for applications that require efficient heat transfer and high thermal densities from medium power dissipation and low profile/package configurations. The module combines a Peltier device, Pumped Heat Exchanger (PHE), and Heat Sink into one integrated package.Application FieldThe ATS-07C-72-C3-R0 is designed to provide cooling solutions for a range of industrial and military electronic devices. This can include devices which generate heat by way of electronics such as power supplies, LED drivers, amplifiers, and power converters. A broad range of applications will benefit from the ATS-07C-72-C3-R0 cooling solution, as it is designed to provide efficient thermal management and consistent cooling when compared to conventional fans, heat sinks, and air conditioning systems.Working PrincipleThe ATS-07C-72-C3-R0 utilizes a Peltier device to transfer heat from one side of the device to the other. This is done by taking advantage of the Seebeck effect, which occurs when two dissimilar metals are connected together and a temperature difference is applied. The ATS-07C-72-C3-R0 utilizes this effect to transfer heat from one side of the device to the other, allowing the system to provide cooling for a device when conventional cooling methods are not feasible or advisable.The ATS-07C-72-C3-R0 also utilizes a Pumped Heat Exchanger (PHE) in order to increase the efficiency of the device, and to ensure that the device runs at its optimal temperature. The PHE operates by using oil to transfer heat away from the component or device that is being cooled, and then dissipating this heat through a network of metal plates which are placed in the heat sink. The heat is then dissipated through fins on the outside of the heat sink in order to cool the airflow. This ensures that the device is cooled effectively, without the need for a fan or additional cooling system. The combination of a Peltier Element and a Pumped Heat Exchanger allows for consistent cooling of the component or device, ensuring long-term reliability and performance.In addition to the Peltier Element and the Pumped Heat Exchanger, the ATS-07C-72-C3-R0 also utilizes a heat sink in order to improve the overall cooling performance of the device. The heat sink is designed to provide a large, flat surface on which the heat can be dissipated from the Peltier element and the Pumped Heat Exchanger. The heat sink is typically made from aluminum and is designed to increase the surface area of the device, allowing for more efficient cooling.The ATS-07C-72-C3-R0 is an ideal solution for those applications which require a low-profile cooling solution, as the module requires minimal additional space in order to operate. Additionally, the device is designed for long-term use in order to maximize the efficiency of the device and improve its overall performance. The combination of a Peltier Element, Pumped Heat Exchanger, and Heat Sink allow for a highly efficient cooling system which is capable of providing consistent cooling for a variety of different electronic devices.