ATS-07D-06-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-07D-06-C3-R0-ND

Manufacturer Part#:

ATS-07D-06-C3-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07D-06-C3-R0 datasheetATS-07D-06-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 20.27°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-07D-06-C3-R0 is a part of the Thermal - Heat Sinks family. It was specifically designed and produced to be used in specific temperature control and management applications. The ATS-07D-06-C3-R0 provides outstanding thermal performance and long-term reliability in electronic applications, as well as proven compatibility with thermal materials.The ATS-07D-06-C3-R0 has the ability to dissipate large amounts of heat away from a hot surface area and the extremely long lifespan of the device, making it an ideal choice for use in a wide variety of applications from everyday consumer electronics to industrial applications. The device is designed to be used in various temperature control and management applications. Heat sinks are also available in other configurations, such as pin fins, flat plates, finless sides, tube fins, and others.Heat sinks are designed to be used in a variety of applications to effectively manage and remove the heat generated by circuit boards and other components. The ATS-07D-06-C3-R0 is constructed with a high-performance material that provides high heat dissipation, low thermal resistance, and long-term reliability. The material is also highly resistant to corrosion, which ensures a long life span and excellent performance over time.The ATS-07D-06-C3-R0 thermal device features a large depth and extremely low thermal resistance that allows for effective heat dissipation in a variety of applications. The device also features a built-in fan for added cooling and convenience, as well as an included air intake filter that reduces dust and debris inside the internal cavity.The ATS-07D-06-C3-R0 thermal device\'s working principle is simple. Heat sinks are designed to be included in an electrical circuit that generates heat, and the Thermal - Heat Sinks can dissipate the heat away from the components with high efficiency. The device works by drawing heat through its walls and using the air around it to cool the internal components. As air is drawn in through the fan, it passes through the heat sink, dissipating the heat from the hot components.In addition to its thermal properties, the ATS-07D-06-C3-R0 thermal device is extremely durable and reliable. The device is made of a highly corrosion-resistant material that ensures long-term reliability, and its construction includes a number of features that extend its longevity. These features include a durable chassis made of anodized aluminum, as well as a ruggedized thermoplastic cover. The housing also includes a retainer system that allows for an optimal fit and secure installation.The ATS-07D-06-C3-R0 Thermal - Heat Sinks is a highly efficient and reliable thermal device that is designed for use in a variety of applications. Its thermal properties provide unparalleled performance, and its construction makes it highly durable and reliable. This device is perfect for applications that require reliable temperature control and management.

The specific data is subject to PDF, and the above content is for reference

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