
Allicdata Part #: | ATS12767-ND |
Manufacturer Part#: |
ATS-07D-117-C2-R0 |
Price: | $ 3.75 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | 3.75000 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
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Thermal management has been a challenge for those responsible for the proper functioning of the electronic machines. ATS-07D-117-C2-R0 is a thermal device which facilitates thermal management by transferring heat away from the delicate electronic components. It is a heat sink with very distinctive applications and working principles.
Application Field:
ATS-07D-117-C2-R0 range of heat sink is mainly used for temperature controlling and dissipating away heat from commercial and industrial applications. It efficiently absorbs and dissipates the heat generated by the electronic components of application such as motor controllers, microcontrollers, microprocessor, IGBT and other application-specific integrated circuits (ASICs).
These heat sinks are primarily designed to gather and take away the heat generated from any electronic component. ATS-07D-117-C2-R0 can also be used as a thermal stabilizer to avoid drastic temperature shifts in the components. It could be used either in free-standing or cassette sizing forms to suit the requirements.
Working Principle:
Heat sinks employ a range of mechanisms for improving the thermal performance. ATS-07D-117-C2-R0 heat sink mainly uses a base material with high thermal conductivity to ensure efficient heat transfer from hot spots on the IC to the environment. It is comprised of an array of fins with required area and number that increases the surface area of the sink, leading to better heat dissipation.
ATS-07D-117-C2-R0 uses a copper layer at its base, which has a very high thermal conductivity, and the evacuated pads between the components and the heat sink. Heat travels from the hot spots on the component by heat conduction mechanism to the heat sink.
The heat dissipated from the component surrounds the fins of the sink, and the heat is transferred to the environment by convection. The heat sink when mounted allows the generated heat to spread out faster, helping in improving the performance of the component. Heat in the heat sink then transfers to the air due to the temperature difference between the sink and the atmosphere.
Conclusion:
ATS-07D-117-C2-R0 heat sink is one of the best heat sinks available in the market. It offers excellent thermal performance and reliability that is needed for efficient thermal management of electronic components. It is particularly useful in temperature controlling and dissipating away heat from commercial and industrial applications. ATS-07D-117-C2-R0 is an effective solution to solve the issue of overheating, leading to improved performance and longer component life.
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