ATS-07D-12-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

The ATS-07D-12-C1-R0 is a thermal heat sink that is widely used in many applications. It is designed to absorb and dissipate heat away from its surroundings and dissipates heat into the atmosphere. This type of thermal heat sink can be used to reduce the temperature of electronic components, and also provide a stable working environment. It is a highly efficient and effective way to keep electronic components cool.

Application Field

The ATS-07D-12-C1-R0 is mainly used in the field of electronic component cooling and protection. It is suitable for application in computer processors, microprocessors, memory chips, power semiconductors, motor drivers, switches, diodes, audio and video equipments, LED lightings, and other electronic components. It is also used for reducing the power consumption and noise caused by excess heat generated by these components.

In addition, it is also used in the field of thermal management for server boards, computers, workstations, and other data centers. By providing excellent heat conduction, thermal protection, and cooling, the ATS-07D-12-C1-R0 helps to reduce the temperature of these servers, and thus prolong the life of the electronic components. Thermal stress is also reduced with the help of the heat sink, as it effectively dissipates heat.

Working Principle

The ATS-07D-12-C1-R0 works on the principle of convection. It transfers the heat from one point to another through the circulation of air. The base plate of the heat sink is made from an aluminum alloy, which is easy to form into different shapes. It has a highly conductive surface which facilitates the flow of heat from the surface of the component that needs cooling to the cooling fins of the heat sink. In addition, the thermal fins are also designed with air vanes, which help to create turbulence in the airflow and thus optimize heat transfer.

The ATS-07D-12-C1-R0 is effective in dissipating heat away from the component. It has fine metal fins that can absorb and spread the heat from the component quickly and efficiently. A thermal paste is normally used to improve the thermal efficiency of the heat sink. The base plate also has a thermal adhesive which helps to improve the contact between the heat sink and the cooled component.

Conclusion

The ATS-07D-12-C1-R0 is a thermal heat sink that is specially designed to dissipate heat away from its surroundings. It is widely used in the field of electronic component cooling and protection, as well as in the field of thermal management for servers and data centers. It works on the principle of convection and has a highly conductive base plate which helps in transferring heat from the component to the cooling fins quickly and efficiently. All of these features make the ATS-07D-12-C1-R0 a very reliable and effective thermal heat sink for many industrial applications.

The specific data is subject to PDF, and the above content is for reference