ATS-07D-150-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-07D-150-C3-R0 Application Field and Working Principle

Heat sinks are essential components in any electronics device. They are designed to absorb and dissipate the heat generated by electronic components. The ATS-07D-150-C3-R0 is a high-end thermal device manufactured by a reputable technology provider. This particular type of heat sink is suitable for applications that require a medium to high level of cooling efficiency. It can be used in a wide range of applications such as cooling servers, integrated circuits and computers. The ATS-07D-150-C3-R0 heat sink is constructed with aluminum fins, which are designed to maximize thermal performance. The fins are connected to a heat pipe, which is used to draw heat away from the internal components. This, in turn, helps the device maintain its cooling performance over a prolonged period. It has a large area for cooling, which helps dissipate the heat faster and more effectively. The device is capable of dissipating up to 150 watts of heat. The ATS-07D-150-C3-R0 is designed to function efficiently in a range of environments. It is capable of operating in temperatures ranging from -20°C to +90°C. Additionally, it is also designed to be compatible with a range of thermal interface materials such as thermal greases and pads.In order to ensure optimal performance of the device, it is important to ensure that it is correctly attached to the component it is designed to cool. The device should be firmly and securely attached to the component with the appropriate thermal interface materials, such as thermal greases and pads. This will ensure that the heat sink is able to effectively draw away heat from the component.When correctly attached to a component, the ATS-07D-150-C3-R0 can be used to improve the performance of a range of electronic components. It is capable of evenly dissipating heat from a component’s surface, resulting in improved performance and faster operation. Additionally, it is also capable of decreasing operating temperature and extending the life of the component.The ATS-07D-150-C3-R0 heat sink is an excellent solution for dissipating heat from electronic components. It is designed to provide optimal cooling for a variety of applications, and its innovative design ensures that it is compatible with a range of thermal interface materials. When installed correctly on a component, it can help to maintain the device’s cooling performance for a prolonged period. As such, the ATS-07D-150-C3-R0 is the ideal thermal device for those looking for an efficient way to dissipate heat away from electronic components.

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