| Allicdata Part #: | ATS-07D-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-07D-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07D-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are devices that are used to easily dissipate heat to the surroundings. They are typically mounted on the top or side of an electronic device in order to help maintain a consistent and stable temperature inside the device. Heat sinks are made of materials that naturally dissipate heat easily without allowing it to recirculate inside the device. The ATS-07D-153-C1-R0 is an aluminum alloy heat sink designed for a wide variety of applications, including computers, server and storage systems, and for general purpose thermal management. The ATS-07D-153-C1-R0 is designed to provide superior thermal performance compared to traditional heat sinks.
The ATS-07D-153-C1-R0 is a combination of copper, aluminum, and iron constructed in a three-layer design. The base layer is made of high-grade copper, which provides good thermal conductivity and helps carry heat away from the surface of the device. On top of the copper layer is an aluminum alloy layer that helps the heat sink dissipate heat faster and further. Finally, the outer layer is made of iron. This outer layer provides the surface area for air to circulate and helps transport the heat from the device to the air.
The ATS-07D-153-C1-R0 has been designed to work with a wide range of applications. For example, it can be used in cooling computer and server processors, memory, and other components. Its combination of copper and aluminum layers makes it ideal for applications requiring high thermal conductivity and heat dissipation. Additionally, the ATS-07D-153-C1-R0 is designed to provide good noise suppression, making it suitable for applications where sound needs to be minimized.
In order to ensure high performance, the ATS-07D-153-C1-R0 is designed to be mounted on the surface of the device in such a way that air can freely circulate around it. This allows the heat sink to dissipate heat effectively and efficiently. In addition, the design helps to reduce hot-spotting, or localized heating, and helps to evenly distribute the thermal load across the device.
The ATS-07D-153-C1-R0 also features several mounting options. It can be attached securely to the surface of the device using screws or clips and can be adjusted to fit differently sized components. Its versatility makes it an ideal choice for a wide variety of applications.
Overall, the ATS-07D-153-C1-R0 is an excellent choice for a wide variety of thermal management applications. Its combination of materials and well-thought-out design allows for superior thermal performance, noise suppression, and versatile mounting options. The ATS-07D-153-C1-R0 is a quality heat sink that is sure to provide excellent performance for a variety of applications.
The specific data is subject to PDF, and the above content is for reference