ATS-07D-170-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-07D-170-C2-R0

The ATS-07D-170-C2-R0 is a relatively new type of thermal heat sink. With this device, engineers are able to effectively manage the temperatures of their electronics and other heat-sensitive components. This type of heat sink is a logical choice for many modern applications, as it offers superior performance and stability when compared to more traditional methods. In this article, we will be exploring the ATS-07D-170-C2-R0 application field and working principle in further detail.

Application Field of ATS-07D-170-C2-R0

The ATS-07D-170-C2-R0 thermal heat sink is ideal for a wide range of applications. This versatile device can be used in consumer electronics, medical devices, telecommunications systems, industrial equipment, and various other systems. In these applications, the heat sink helps to improve the system\'s performance and overall lifetime, while also ensuring that the electronic components do not reach their maximum temperature and become potentially hazardous. Moreover, this thermal heat sink also has the capabilities of reducing system noise, as it absorbs the vibration and noise generated by the cooling system.

Working Principle of ATS-07D-170-C2-R0

The ATS-07D-170-C2-R0 thermal heat sink works by transferring heat away from the source device or component. As the heat transfer occurs, the heat sink absorbs the heat and transfers it to the surrounding environment via convection and conduction, as well as radiation. The aluminum fins on the ATS-07D-170-C2-R0 heat sink are used to amplify the natural convection and radiation effect, thereby allowing for greater efficiency. This diel device is also equipped with multiple fins for added heat dissipation. The device is also designed in such a way that it allows for a low profile design, meaning it can be installed even in places where space is limited.

Conclusion

The ATS-07D-170-C2-R0 thermal heat sink is a versatile device that can be used for a range of applications. It works by transferring heat away from the source device or component, and is highly efficient due to its low profile design and enhanced fin design. As such, it is a great choice for a range of applications that require efficient heat transfer and noise-dampening capabilities. With these features, the ATS-07D-170-C2-R0 thermal heat sink is a great choice for those who require an effective and efficient cooling solution for their products.

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