| Allicdata Part #: | ATS-07D-175-C1-R0-ND |
| Manufacturer Part#: |
ATS-07D-175-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07D-175-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to extend the lifespan of electrical products and keep their performance optimized. ATS-07D-175-C1-R0, a thermal management solution from ATS, is designed to do exactly that. The product is both flexible and cost-effective, making it a prime candidate for a wide variety of applications.
Introduction to ATS-07D-175-C1-R0
The ATS-07D-175-C1-R0 is a low-profile, all-purpose heat sink. It can be used in both residential and commercial applications, making it a great choice for thermally demanding applications. The product is also UL certified, adding to its appeal.
The heat sink has an aluminum base with a black anodized finish. The fins are specifically designed to provide excellent thermal performance, and the base has integrated mounting points for mounting the heat sink to the PCB.
Application Fields of ATS-07D-175-C1-R0
ATC-07D-175-C1-R0 is an ideal choice for cooling components such as LEDs, microprocessors, and other semiconductors that generate a high amount of heat. It is also commonly used in telecom and industrial automation applications. The product is also suitable for applications such as computers, gaming consoles, printers, projectors, and other consumer electronics.
The heat sink is also used in medical and transportation applications as well as some aerospace applications. The heat sink’s flexible design makes it a great choice for projects in which space and weight savings are a priority. The product is also designed to be robust and reliable, making it the ideal choice for extended-use applications.
Working Principle of ATS-07D-175-C1-R0
The ATS-07D-175-C1-R0 works by dissipating heat away from the component and into the environment. This is achieved by transferring the heat generated by the component into the heat sink via thermal conduction. The heat sink then disperses the heat into the surrounding air. This process keeps the component cool and its performance optimized.
The heat sink has several features that enable it to provide effective thermal management. The aluminum base is designed to conduct heat from the component more efficiently, while the black anodized finish increases its cooling potential. The fins are also designed to provide a large surface area, which increases the amount of heat that can be dissipated into the environment.
Conclusion
The ATS-07D-175-C1-R0 is a great choice for thermally demanding applications. The product is UL certified, cost-effective, and flexible, making it suitable for a wide range of applications. The product is designed to dissipate heat efficiently, ensuring optimal performance of the component. It is a great solution to keep components cool while ensuring their longevity.
The specific data is subject to PDF, and the above content is for reference