| Allicdata Part #: | ATS-07D-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-07D-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07D-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial part in the operations of modern electronic equipment. To maintain the temperature of electronic components, an efficient thermal management system must be utilized. The ATS-07D-30-C3-R0 Heat Sink is a perfect example of an efficient and high-performance heat management system. It has a wide range of applications and a simple working principle.
The ATS-07D-30-C3-R0 Heat Sink is designed to dissipate heat generated by electronic components and to protect the components from over-heating or excessive operating temperatures. The heat sinks are designed to be compatible with a variety of electronic components and systems, including CPUs, GPUs, audio amplifiers, and power supplies. This makes the ATS-07D-30-C3-R0 Heat Sink an efficient way of dissipating heat and keeping the components within their operating temperature range.
The ATS-07D-30-C3-R0 Heat Sink is constructed from aluminum fins, which act as a large surface area to efficiently dissipate the heat generated by electronic components. The aluminum fins are attached to a copper base, which further increases the heat dissipation. The copper base is designed in such a way that it evenly distributes the heat to the fins for maximum efficiency.
The ATS-07D-30-C3-R0 Heat Sink is designed to provide excellent performance and stability. The aluminum fins channell the air flow, which helps to further increase the rate of heat dissipation. The fins are also shaped in a specific way, which allows for more efficient heat transfer. The copper base also plays a crucial role in heat dissipation by allowing the heat generated by the components to spread evenly. The copper base also helps to keep the components cooler by providing a wide surface area for air flow.
The ATS-07D-30-C3-R0 Heat Sink can be used in a variety of applications. It can be used for keeping CPUs and GPUs cool, for audio amplifiers, and power supplies. This makes the heat sink suitable for use in a wide range of environments, including high-temperature environments. The aluminum fins and copper base also make the heat sink suitable for industrial use, as it allows for efficient heat dissipation.
The ATS-07D-30-C3-R0 Heat Sink is a highly efficient and reliable heat management solution. Its aluminum fins and copper base work together to effectively dissipate the heat generated by electronic components, while its compatibility with a wide range of components makes it an effective choice for a variety of applications. In addition, its wide surface area and durable construction make it ideal for industrial use.
The specific data is subject to PDF, and the above content is for reference