ATS-07D-33-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-07D-33-C1-R0-ND

Manufacturer Part#:

ATS-07D-33-C1-R0

Price: $ 5.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07D-33-C1-R0 datasheetATS-07D-33-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.86990
30 +: $ 4.59900
50 +: $ 4.32860
100 +: $ 4.05802
250 +: $ 3.78748
500 +: $ 3.51695
1000 +: $ 3.44932
Stock 1000Can Ship Immediately
$ 5.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heatsinks are a key component in a wide variety of applications. And the ATS-07D-33-C1-R0 model is known for its good thermal performance. In this article, we’ll explore the application field and working principle of the ATS-07D-33-C1-R0 thermal-heat sinks.

The ATS-07D-33-C1-R0 model is a medium-sized aluminum heatsink, suitable for applications which require a reliable and efficient cooling solution. It is designed to dissipate heat generated from various electrical devices, such as CPUs, power amplifiers, video cards, and DSPs. It is also suitable for applications where space is limited, such as embedded systems.

The ATS-07D-33-C1-R0 model features a unique chassis design which allows it to be mounted directly onto the PCB, helping improve the thermal efficiency. This is especially useful in applications where multiple heatsink models are used in parallel.

The ATS-07D-33-C1-R0 thermal-heat sinks have long been praised for their thermal performance. The dissipated heat is quickly transferred to the surrounding air through the four-/five-layer base-plate and fin construction. This base plate is made of high-grade aluminum for maximum heat transfer and long life. The fins are generously spaced for faster heat dissipation and improved air flow.

The ATS-07D-33-C1-R0 heat-sINKs feature a built-in fan for additional cooling when necessary. The fan is engineered to be highly reliable, with a long life expectancy. The fan is also designed to move large volumes of air with low noise levels.

The working principle of the ATS-07D-33-C1-R0 thermal-heat sinks is relatively simple. Heat is generated in the device, and the heatsink transfers the thermal energy from the device to the surrounding air. The heat is transferred through conduction, which occurs between solid objects that are in close contact, and radiatively, where heat energy is emitted in the form of infrared radiation. The aluminum base plate and fins are responsible for efficiently conducting and radiating the dissipated heat. The fan is used to ensure good airflow for efficiently dispersing the heat.

In conclusion, the ATS-07D-33-C1-R0 model is a reliable and efficient thermal-heat sink suited for a variety of applications. Its robust chassis design allows it to be mounted directly to the PCB. The four-/five-layer base plate and fin construction offers excellent thermal performance, while the built-in fan ensures good airflow and low noise levels. The ATS-07D-33-C1-R0 model is a great choice for applications that need fast, reliable, and efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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