| Allicdata Part #: | ATS-07D-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-07D-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07D-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in ensuring proper functioning of electronic devices. Heat dissipation through the use of heat sinks is one of the most common methods for managing the build-up of heat in devices. The ATS-07D-80-C3-R0 is a unique type of thermal management device, designed specifically for use in high temperature environments.
The ATS-07D-80-C3-R0 is a heat sink designed to be used in high-temperature applications. It is a fin-type heat sink, commonly referred to as a fin array, which is designed to dissipate heat more efficiently due to its increased surface area. The ATS-07D-80-C3-R0 is composed of 60 high-quality aluminum fins, which are connected to an extruded aluminum base. This fin array is designed to provide thermal relief in extreme temperatures, up to 175°C
The ATS-07D-80-C3-R0 is optimized with an airflow design, which ensures that it can effectively dissipate heat. The fin array is designed to maximize the surface area exposed to air, which allows it to disperse heat efficiently. Its design includes optimization for surface wetting, meaning that it will allow liquid to flow across its surface more effectively, increasing the rate of heat dissipation. Additionally, the ATS-07D-80-C3-R0 features a flat base which makes it more compatible with mounting surfaces.
The ATS-07D-80-C3-R0 is an effective device for managing heat in high-temperature environments. Its fin array design ensures it can dissipate heat efficiently, while its optimization for surface wetting provides additional performance for cooling liquid-cooled electronics. Additionally, its flat base makes it more compatible with devices with limited mounting space. This makes the ATS-07D-80-C3-R0 an ideal heat management device for any environment that requires effective, reliable heat dissipation.
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