
Allicdata Part #: | ATS12933-ND |
Manufacturer Part#: |
ATS-07D-96-C2-R0 |
Price: | $ 4.97 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X35MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.51710 |
10 +: | $ 4.39551 |
25 +: | $ 4.15120 |
50 +: | $ 3.90701 |
100 +: | $ 3.66282 |
250 +: | $ 3.41863 |
500 +: | $ 3.17444 |
1000 +: | $ 3.11340 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.63°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are devices that serve as a means of transferring heat dissipated from an electronic device into the environment, containing enough heat pipe or fins to dissipate heat effectively. Due to the importance of effective thermal management, these components are essential for any electronic application. One of the more common heat sinks on the current market is the ATS-07D-96-C2-R0, and this article will take a closer look at the application fields and working principle of this particular product.
Application Fields
The ATS-07D-96-C2-R0 is an all-in-one thermal management solution, designed to be used in a wide variety of applications. It is most often used as a cooling device for LED lighting, as well as various other electronic systems, including servers, computers, video cards, CPUs, and more. It is also an excellent choice for applications that require maximum cooling efficiency, such as communication systems, power supplies, medical devices, and automotive systems.
The ATS-07D-96-C2-R0 has a variety of features that make it an ideal choice for these applications. For example, it is highly durable and reliable, and has high thermal conductivity. Moreover, it has an adjustable temperature range, meaning that it can maintain optimal temperatures for various applications, and its high density fins ensure maximum heat dissipation. Finally, it is also compact and light weight, making it easy to install in tight spaces and minimising the risk of component damage caused by excessive heat.
Working Principle
The ATS-07D-96-C2-R0 works by transferring the heat generated by an electronic device, such as a processor or microcontroller, into the environment. To accomplish this, the device is placed on top of the heat sink, which is connected to a thermal interface material. This thermal interface material, such as thermal grease, is used to increase heat transfer between the device and the heat sink. The heat is then dissipated away from the device and into the environment through the heat sink’s array of thermal channels and fins.
The thermal channels and fins on the ATS-07D-96-C2-R0 are specifically designed to offer maximum cooling efficiency and protection from heat damage. The design of the channels and fins allows air to move efficiently over the surface of the heat sink, allowing the device to stay cool even in a particularly hot environment. Furthermore, the fins are designed for optimal heat dissipation, meaning that the heat sink can cope with devices that generate high levels of heat. Finally, the heat sink is also designed for maximum durability, ensuring that it can provide long-term performance and reliability.
Conclusion
The ATS-07D-96-C2-R0 is an excellent all-in-one thermal management solution for a variety of applications, including LED lighting, servers, computers, video cards, CPUs, and more. It is highly durable and reliable, and offers maximum cooling efficiency thanks to its adjustable temperature range, high thermal conductivity, and high-density fins. All of these features make it an ideal choice for electronic devices that require effective thermal management.
The specific data is subject to PDF, and the above content is for reference