| Allicdata Part #: | ATS-07E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-07E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are extremely important components in the thermal management of almost all electrical and electronic circuits. They are used to provide an effective way to dissipate the heat produced by the devices to the ambient air. The ATS-07E-117-C1-R0 is a high-performance, compact heat sink designed for a wide range of applications. This heat sink utilizes a unique combination of a low-profile size, lightweight materials, and high-performance air cooling fins that can be used to reduce the overall temperature of the unit.
The ATS-07E-117-C1-R0 is designed to provide a simple and effective solution for dissipating heat within tight spaces. It comes with ultra-slim fins that are available in different shell sizes to fit most applications. It also comes with multiple mounting options, allowing it to be used in conventional, unconventional, and even in custom-made chassis.
The ATS-07E-117-C1-R0 offers high performance cooling, utilizing a combination of a high-density aluminium fins and a copper heat pipe to ensure efficient heat management. The aluminium heat sink fins provide maximum thermal transfer, while the copper pipe ensures that the heat is evenly distributed across the fins. In addition, the use of air cooling fins helps to provide air circulation around the heat sink, which helps to increase its efficiency. The use of light weight materials makes it easy to install, and the fin size maximises the cooling area.
The ATS-07E-117-C1-R0 is designed to be used in almost any industrial, commercial, or residential environment. Its multi-mount design allows for easy installation on walls, back plates, chassis, and other surfaces. Additionally, due to its slim fin design, it can be mounted in even the most confined spaces. The heat sink is extremely versatile and can be used in a wide range of applications, such as computers, consumer electronics, telecommunication devices, and more.
The ATS-07E-117-C1-R0 provides effective cooling and protection of sensitive equipment. With its low noise operation and low power consumption, it can be used in a variety of applications, both for high ambient temperatures and harsh environments. Furthermore, its slim profile design allows the device to be easily retrofitted into existing installations.
In addition to its performance benefits, the ATS-07E-117-C1-R0 is also designed for easy installation and maintenance. It features a simple two-screw mounting system, enabling quick and easy installation. Additionally, the device is also resistant to dust and contaminants, allowing for easy cleaning. Its low profile design also makes it easier to reach into tight spaces for maintenance and repairs.
The ATS-07E-117-C1-R0 is a simple, yet effective thermal management device designed for a wide range of applications. Its high performance cooling, low power consumption, and low noise operation makes it the perfect choice for any environment. Its slim design and easy installation makes it an ideal solution for the ever-growing needs of cooling and protection of sensitive devices.
The specific data is subject to PDF, and the above content is for reference