| Allicdata Part #: | ATS12993-ND |
| Manufacturer Part#: |
ATS-07E-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are designed to absorb and dissipate very large amounts of thermal energy and are commonly used to control temperatures in a variety of industrial applications. The ATS-07E-142-C2-R0 thermal heat sink is a high-performance heat sink suitable for cooling computer processors, embedded systems, and other high-power electronic devices.
The main components of the ATS-07E-142-C2-R0 thermal heat sink include a metal base with a heat spreader plate between the base and the heatsink fins. The heat spreader plate is designed to maximize the thermal conduction of the heat away from the processor to the heat sink fins. The fins are also designed with curved edges to increase the surface area exposed to the air to help dissipate the thermal energy even further.
The primary purpose of the ATS-07E-142-C2-R0 thermal heat sink is to dissipate heat away from the device being cooled. This is done by passively transferring thermal energy from the surface of the heat spreader plate and fins of the heat sink to the surrounding environment. In order to maximize the amount of heat that can be dissipated and to ensure that the heat sink is operating at its maximum efficiency, the fans and other cooling components are designed to direct cool air toward the heat sink. This forced air flow helps to ensure that heat is dissipated quickly and efficiently.
In addition to its primary purpose of dissipating heat away from the system, the ATS-07E-142-C2-R0 thermal heat sink is also designed to absorb and store thermal energy. This thermal energy can be used to start up the system or provide additional cooling power at peak load times. The thermal energy is stored in the heat spreader plate, which acts as a thermal buffer to help absorb thermal energy when the system is overloaded.
The ATS-07E-142-C2-R0 thermal heat sink is a highly efficient and dependable thermal management solution for equipment that requires a large cooling capacity. With its versatile design, it can easily accommodate the cooling needs of a variety of applications, from embedded electronics to computer processors and other high-power electronics. Its impressive thermal performance and dependability make it an ideal choice for any application requiring a reliable thermal solution.
The specific data is subject to PDF, and the above content is for reference