| Allicdata Part #: | ATS-07E-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-07E-16-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management within electronics is one of the most important aspects of design. Heat sinks are one of the most popular methods of dissipating heat as well as preventing heat build up in various applications. The ATS-07E-16-C1-R0 heat sink is designed to be one of the finest thermal products available on the market and is used in countless electronic applications.
The ATS-07E-16-C1-R0 is capable of dissipating up to 6.62 watts of heat at a temperature of 0.55 K and has a thermal resistance of 0.08 degrees Celsius/watt. Not only is this heat sink ideal for industrial applications that require extra cooling, it is also suitable for applications that require moderate dissipation such as telecom, medical instrumentation, consumer electronics, and more.
The ATS-07E-16-C1-R0 heat sink is designed using a combination of a wafer/plate and extrusion. The extrusion process creates a perfectly smooth surface with maximum contact area, while the wafer/plate offers a superior thermal resistance value. This combination of the two materials provides a highly efficient design, while offering excellent performance in both directional and symmetrical applications.
In terms of performance, this heat sink is highly efficient. The fins have a large surface area, which helps maximize heat transfer. Additionally, the fins are designed with a special angle to promote efficient air flow, improved air circulation, and increased cooling performance. This design also helps reduce thermal bridging, enabling more efficient dissipation of heat.
In terms of installation, the ATS-07E-16-C1-R0 is a breeze. It is equipped with mounting hardware and clips for easy installation, and is also compatible with various mounting solutions. As a result, it can be quickly and easily installed into virtually any system or application.
The ATS-07E-16-C1-R0 heat sink is an ideal choice for any application that requires a reliable and efficient cooling solution. Its efficient design and high performance make it a perfect choice for a wide variety of systems and applications. No matter what the application may be, the ATS-07E-16-C1-R0 is certain to offer a dependable cooling solution.
The specific data is subject to PDF, and the above content is for reference