ATS-07E-174-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-07E-174-C1-R0 Thermal-Heat Sinks Introduction

Thermal-heat sinks are an essential component of many electronic applications. The ATS-07E-174-C1-R0 is a thermal-heat sink manufactured by MARS Co., Ltd. It is designed for use in applications where thermal insulation and efficient heat transfer are required. This article will discuss the application fields and working principles of the ATS-07E-174-C1-R0 thermal-heat sink.

Application Fields of ATS-07E-174-C1-R0 Thermal-Heat Sinks

The ATS-07E-174-C1-R0 thermal-heat sink can be used in a variety of applications. These include computerized central processing units (CPUs), light-emitting diodes (LEDs), and power supplies. It can also be used to quickly dissipate heat generated by high-performance electrical components and systems. The ATS-07E-174-C1-R0 thermal-heat sink is designed to absorb and dissipate heat in the most efficient manner possible. The efficient thermal performance makes it an ideal choice for applications that demand precision temperature control and heat dissipation. This includes industrial, automotive, and consumer electronics applications.

Construction of ATS-07E-174-C1-R0 Thermal-Heat Sinks

The ATS-07E-174-C1-R0 thermal-heat sink is constructed from a special heat-conductive material, specifically designed to offer high thermal conductivity and low thermal resistance. This ensures maximum heat transfer from the hot components to the heat sink. The base of the heat sink is shaped to fit precisely over the components, providing a close contact to reduce air gaps and Thermally Interface Material (TIM) requirements. The ATS-07E-174-C1-R0 thermal-heat sink also features a scalable design, allowing it to be used in a variety of applications. It is available in three different sizes to accommodate the specific size requirements of each application. The sink also contains a series of heat pipes and fins, which allows for improved heat dissipation.

Working Principles of ATS-07E-174-C1-R0 Thermal-Heat Sinks

The working principle of the ATS-07E-174-C1-R0 thermal-heat sink is relatively simple. Heat from the components is transferred to the heat sink through the heat-conductive material. The heat is then dissipated through the fins and pipes. This is done by convection, which is the process by which air is heated and rises, carrying the heat away from the heated components. The heat is then dissipated into the atmosphere.The result is that heat is removed from the components more quickly and efficiently, significantly reducing temperature and power module thermal profile. This reduces the thermal stress on the components and lengthens the lifespan of the device.

Conclusion

The ATS-07E-174-C1-R0 thermal-heat sink is a versatile and efficient component for many electronic applications. Its robust design and construction ensures reliable performance and maximum heat dissipation. Its scalable design allows it to be used in a variety of applications, from industrial to automotive to consumer. With its efficient working principles, the ATS-07E-174-C1-R0 thermal-heat sink is an excellent choice for any project that requires fast and reliable thermal management.

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