| Allicdata Part #: | ATS-07E-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-07E-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-07E-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are becoming increasingly important in today’s technology industries. Heat sinks are heat transfer components used to cool electrical components by dissipating heat into the surrounding environment. The ATS-07E-200-C3-R0 is a popular heat sink used in many applications where thermal control is essential. In this article, we will discuss the application field and working principle of the ATS-07E-200-C3-R0.
The ATS-07E-200-C3-R0 is ideal for applications where high levels of thermal performance are required. This heat sink is light in weight, making it easy to mount with a wide range of devices. It is made of highly efficient extruded aluminum alloy, enabling it to some of the highest thermal performance values. This heat sink is also capable of dissipating 200 watts of heat, making it suitable for many applications.
The ATS-07E-200-C3-R0 is designed to be used in a variety of applications including computer systems, telecommunication units, electronic circuits, medical and industrial equipment, as well as power supplies. In each of these applications, the heat sink is designed to remove heat from the system in an efficient manner, increasing the system’s overall performance. The heat sink is also designed to be low profile and unobtrusive, allowing it to fit into most any application. The ATS-07E-200-C3-R0 is also designed to be highly efficient, providing improved thermal performance.
The working principle of the ATS-07E-200-C3-R0 is simple but effective. The heat sink is designed to take in heat from the device that generates heat. This heat is then dissipated through the heat sink itself and into the surrounding environment. The heat sink is designed with fins that increase its surface area, allowing it to dissipate more heat and keep the device temperature low. The fins also create a large surface area that allows for faster heat transfer, allowing the device to stay cool longer.
The ATS-07E-200-C3-R0 is a versatile heat sink that can be used in a variety of applications, ranging from computer systems to medical devices. It is designed to dissipate heat quickly and efficiently, making it a great choice for increasing system performance. The ATS-07E-200-C3-R0 is light in weight, easy to mount, and highly effective at dissipating heat, making it an ideal choice for any application that requires effective thermal solutions.
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